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Electronucleation mechanism of copper in wastewater by controlled electrodeposition analysis

机译：控制电沉积分析废水中铜的电切割机理

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In order to improve the efficiency of copper deposition in wastewater containing the surfactant polyvinylpyrrolidone (PVP) and reveal the mechanism of copper crystals, a controlled electrodeposition process was developed using a low-cost stainless steel cathode and investigated using chronoamperometry (CA), electrochemical impedance spectroscopy (EIS) and infrared spectroscopy (IR). The theoretical analysis was verified by fitting them to experimental curves and calculating the kinetic parameters of the deposition process. The experimental results showed that Cu(PVP) _(2) was formed by the reaction between the CO bond of PVP and Cu ~(2+) . When powdered, reduction of Cu ~(2+) in the Cu(PVP) _(2) structure was promoted, a positively-charged PVP-coating layer was formed on the surface of the copper crystal nuclei to inhibit the growth of the copper powder. At a potential of ?0.2 V, the electrodeposition crystallization curve of copper changed from progressive nucleation to instantaneous nucleation. The kinetic parameters of the deposition process were calculated by fitting the experimental curves to verify the correctness of the theoretical analysis. The EIS tests showed that removing the powder reduced the resistance of the organic solvent (PVP) film on the electrode surface and the charge transfer resistance during copper deposition. According to particle size analysis, removing the powder could reduce the growth energy of copper powder on the electrode surface, increase the area of the active part on the electrode surface, increase the current efficiency of copper powder to 84.2%, and control dust. The size of copper powder reached up to around 900 nm.
机译：为了提高含有表面活性剂聚乙烯吡咯烷酮（PVP）的废水中铜沉积的效率并揭示铜晶体的机理，使用低成本的不锈钢阴极进行控制的电沉积工艺，并使用计时率（CA）进行研究，电化学阻抗研究光谱学（EIS）和红外光谱（IR）。通过将它们拟合到实验曲线并计算沉积过程的动力学参数来验证理论分析。实验结果表明，Cu（PVP）_（2）通过PVP和Cu〜（2+）的CO键之间的反应形成。当促进Cu（PVP）_（2）结构中的Cu〜（2+）的粉末时，在铜晶核的表面上形成带正电荷的PVP涂层，以抑制铜的生长粉末。在Δ0.2V的潜力处，电沉积的铜的结晶曲线从逐渐成核变化到瞬时成核。通过拟合实验曲线来计算沉积过程的动力学参数以验证理论分析的正确性。 EIS测试显示，除​​去粉末在铜沉积期间降低了粉末在电极表面上的有机溶剂（PVP）膜的电阻和电荷转移电阻。根据粒度分析，除去粉末可以降低电极表面上的铜粉的生长能量，增加电极表面上有源部分的面积，将铜粉的电流效率提高到84.2％，控制粉尘。铜粉的尺寸达到高达约900nm。

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