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Through-holes, cavities and perforations in polydimethylsiloxane (PDMS) chips

机译：聚二甲基硅氧烷（PDMS）芯片中的通孔，空腔和穿孔

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We present a method to fabricate through-holes between 10 to 180 μm between polydimethylsiloxane (PDMS) layers of microfluidic large-scale integration platforms. Therefore we employed standard PDMS spin-coating processes onto silicon molds with microstructures formed from SU-8 and AZ photoresists. Our approach is based on the modification of the surface polarity of the PDMS prototyping molds by a 250 nm thick layer of octafluorocyclobutane (C _(4) F _(8) ), which resulted in a contact angle of 125 ± 3° for water. This super hydrophobic surface repelled PDMS from microstructures protruding out of the spin coated PDMS layer. Subsequently, we applied and characterized the C _(4) F _(8) coating for the robust fabrication of interlayer connectors between PDMS membranes of 40 μm thickness. To enable embedding of through-holes, perforations and/or cavities in very thin layers of PDMS (<20 μm) we mixed PDMS with a PDMS based silicone oil to reduce its viscosity. In contrast to previous attempts to lower the viscosity of PDMS using organic solvents, the silicone oil cross-linked to PDMS and was thus, unable to freely diffuse into the polymerized PDMS. This reduces the risk for bleeding of hazardous components in biological applications. Finally, we manufactured a three layer mLSI chip with integrated cavities for catching fluorescently labeled beads and cells. The presented process parameters can easily be adapted to specific needs in the fabrication of multi-layer PDMS arrangements by following the systematic parameter screening.
机译：我们介绍了一种在微流体大规模集成平台的聚二甲基硅氧烷（PDMS）层之间的10至180μm之间的过孔。因此，我们将标准PDMS旋转涂覆工艺用作硅模具，其具有由SU-8和AZ光致抗蚀剂形成的微观结构。我们的方法基于通过250nm厚的八氟环丁烷（C _（4）F _（8））的250nm厚层的PDMS原型模具的表面极性的改变，从而导致水的接触角为125±3° 。该超级疏水表面从旋转涂覆的PDMS层突出的微结构中排斥了PDMS。随后，我们施加并表征了用于在40μm厚度的PDMS膜之间的中间层连接器的鲁棒制造的C _（4）F _（8）涂层。为了使得在非常薄的PDMS（<20μm）的薄层（<20μm）中嵌入嵌入通孔，穿孔和/或空腔，其用基于PDMS的硅油混合PDMS以降低其粘度。与先前试图使用有机溶剂降低PDMS的粘度，与PDMS交联并且因此不能自由地扩散到聚合的PDMS中。这降低了生物应用中危险组分出血的风险。最后，我们制造了三层MLSI芯片，其具有集成空腔，用于捕获荧光标记的珠粒和细胞。通过遵循系统参数筛选，所呈现的过程参数可以容易地适应于制造多层PDMS布置中的特定需求。

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