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首页> 外文期刊>International Journal of Electrochemical Science >Effect of Fluorocarbon Surfactant on Electroforming of Copper Nano-Powders
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Effect of Fluorocarbon Surfactant on Electroforming of Copper Nano-Powders

机译：氟碳表面活性剂对铜纳米粉末电铸的影响

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摘要

The electrodeposition behavior, morphology, and particle size of copper nano-powders prepared using fluorocarbon surfactants or fluorocarbon combined with non-ionic compound surfactants were characterized by linear sweep voltammetry, cyclic voltammetry, X-ray diffraction, and field emission scanning electron microscopy. Copper nano-powders prepared using fluorocarbon surfactant or fluorocarbon, non-ionic compound surfactants without added sulfuric acid did not adhere to the plate. The fine particle size of the copper powders, which was mainly influenced by the anionic fluorocarbon surfactant, ranged from 50 to 200 nm. The powder morphology mainly depended on the non-ionic surfactant, and the electrodeposition process was governed by diffusion. The cyclic voltammetry curve indicated that the cathode peak current density is inversely proportional to the plate surface coverage. The change of current density in the electrodeposition process was directly related to the current efficiency. The mechanism of the formation of copper nano-powders by microemulsion electrodeposition was established and explained.
机译：使用氟碳表面活性剂或碳氟化合物与非离子表面活性剂化合物的特点是线性扫描伏安法，循环伏安法，X射线衍射，和场发射扫描电子显微镜相结合制备的电沉积行为，形态学和粒子铜纳米粉末的大小。铜纳米粉末使用氟碳表面活性剂或碳氟化合物，不添加硫酸非离子表面活性剂化合物不附着于板制备。铜粉末的细颗粒尺寸，这是主要由阴离子氟碳表面活性剂的影响，范围从50至200nm。该粉末的形态主要取决于非离子表面活性剂和电沉积过程受扩散控制。循环伏安曲线表明，阴极峰值电流密度是反比于板的表面覆盖。电流密度在电沉积过程中的变化直接相关的电流效率。成立，并解释由微乳液电沉积铜纳米粉末的形成的机理。

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