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首页> 外文期刊>IEEE Transactions on Dielectrics and Electrical Insulation >Calculation on heating effect due to void discharge in polymers in cumulative breakdown process
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Calculation on heating effect due to void discharge in polymers in cumulative breakdown process

机译：累积击穿过程中聚合物空隙放电引起的热效应计算

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摘要

The relation between PDs and the growth of the discharge channel in polymers in a cumulative breakdown process under short pulses is investigated. By comparison with the Pachen Curve, it is found that the critical size for voids to discharge is in μm class. The heat deposition on the wall of voids is also calculated with a result that the temperature rise (ΔT) after one discharge is in a class of hundreds of Kelvin (K) and ΔT under a repetition rate greater than 100 Hz is tens of K for different types of polymers. The temperature rise has two effects on the voids in polymers: one is to cause the voids to crack along the direction of the applied electric field and the other is to cause local thermal breakdowns to occur in the vicinity of the void wall. Both of these effects lead to the growth of a discharge channel in polymers. The images observed in the cumulative breakdown process of PMMA (organic glass) using an on-line microscope under short pulses are presented to support the analysis.
机译：研究了PD在短脉冲下累积击穿过程中PD与放电通道生长之间的关系。通过与帕亨曲线比较，发现空隙排出的临界尺寸为μm级。还计算了在空隙壁上的热量沉积，结果是，一次放电后的温度升高（ΔT）处于百开尔文（K）的级别，并且在大于100 Hz的重复频率下，ΔT为数十K不同类型的聚合物。温度升高对聚合物中的空隙有两个影响：一个是使空隙沿所施加电场的方向破裂，另一个是使空隙壁附近发生局部热击穿。这两种作用都导致聚合物中放电通道的增长。呈现了在短脉冲下使用在线显微镜在PMMA（有机玻璃）的累积分解过程中观察到的图像，以支持分析。

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