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首页> 外文期刊>Journal of display technology >Thermal and Optical Performance of a Light-Emitting-Diode Metal Package With an Integrated Reflector and Heat Spreader Structure
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Thermal and Optical Performance of a Light-Emitting-Diode Metal Package With an Integrated Reflector and Heat Spreader Structure

机译：具有集成反射器和散热器结构的发光二极管金属封装的热和光学性能

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摘要

We develop a light-emitting diode (LED) metal package consisting of a reflector integrated with a heat spreader as one body. The structure functions obtained from the thermal transient measurement reveals that the integrated structure of the metal package leads to improved thermal performance. We make significant efforts to clarify the interaction between the extracted light from the LED chip and the inside surface of the metal package. The radiant flux from the LED chip is calculated from the definition of thermal resistance and is implemented as an input parameter to predict the optical power and ray tracing. The simulated optical output power in the far-field mode is 145.3$~$mW, which is in good agreement with the value measured by an integrating sphere. It is shown that a large portion of the emitted light (37.12 mW) is lost by the interaction with the package surface before it reaches the far-field receiver. It is demonstrated that the angle of the first reflector cup is one of the critical design parameters in the metal package structure that we investigate. When the first reflector angle is optimized from 80$^{circ}$ to 55$^{circ}$ (with the second reflector angle of 50 $^{circ}$), the optical power increases from its original value of 145.3–170.15 mW with an improved optical extraction efficiency from 75.63% to 88.57%. The ray tracing and illuminance raster charts also confirm that the improved optical performance of the metal package mainly stems from the optimization of the reflector angles.
机译：我们开发了一种发光二极管（LED）金属封装，其中包括一个与散热器集成在一起的反射器作为一体。从热瞬态测量获得的结构函数表明，金属封装的集成结构可改善热性能。我们做出了巨大的努力，以澄清从LED芯片提取的光与金属封装的内表面之间的相互作用。根据热阻的定义来计算来自LED芯片的辐射通量，并将其作为输入参数来预测光功率和光线追踪。远场模式下的模拟光输出功率为145.3 $〜$ mW，与该值非常吻合用积分球测量。结果表明，在到达远场接收器之前，与封装表面的相互作用会损失大部分发射光（37.12 mW）。结果表明，第一个反射杯的角度是我们研究的金属封装结构中的关键设计参数之一。当第一个反射器角度从80 $ ^ {circ} $ 优化为55 < tex Notation =“ TeX”> $ ^ {circ} $ （第二个反射角为50 $ ^ {circ} $ ），光功率从其原始值145.3–170.15 mW增加，光提取效率从75.63％提高到88.57％。射线追踪和照度光栅图还证实，金属封装的光学性能提高主要来自反射镜角度的优化。

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