Systematic Power Integrity Analysis Based on Inductance Decomposition in a Multi-Layered PCB PDN

Biyao Zhao; Siqi Bai; Samuel Connor; Stephen Scearce; Matteo Cocchini; Brice Achkir; Albert Ruehli; Bruce Archambeault; Jun Fan; James Drewniak

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Systematic Power Integrity Analysis Based on Inductance Decomposition in a Multi-Layered PCB PDN

机译：基于电感分解在多层PCB PDN中的系统功率完整性分析

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An approach is presented for power integrity analysis on multi-layer printed circuit boards in this paper. Two critical current paths are analyzed. Inductance decomposition is applied to identify the critical parameters that can influence the PDN input impedance. Two types of stack-ups are used to perform sensitivity analysis to illustrate the effectiveness of PDN design guidelines. Based on the analysis of the inductance contribution from different blocks in the PCB PDN, a systematic approach to obtain a complete understanding of PDN behavior is proposed. The approach can be used to provide design guidance in PDN design practice.

机译：本文对多层印刷电路板的电力完整性分析提出了一种方法。分析了两个临界电流路径。电感分解应用于识别可以影响PDN输入阻抗的关键参数。两种类型的叠层用于执行灵敏度分析，以说明PDN设计指南的有效性。基于PCB PDN中不同块的电感贡献的分析，提出了获得对PDN行为完全理解的系统方法。该方法可用于提供PDN设计实践中的设计指导。

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来源
《Electromagnetic Compatibility Magazine, IEEE》 |2020年第4期|80-90|共11页
作者
Biyao Zhao; Siqi Bai; Samuel Connor; Stephen Scearce; Matteo Cocchini; Brice Achkir; Albert Ruehli; Bruce Archambeault; Jun Fan; James Drewniak;
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作者单位

Missouri University of Science and Technology Rolla MO USA;

Missouri University of Science and Technology Rolla MO USA;

IBM Corporation USA;

Cisco Systems Inc. USA;

IBM Corporation USA;

Missouri University of Science and Technology Rolla MO USA;

Missouri University of Science and Technology Rolla MO USA;

Cisco Systems Inc. USA;

Missouri University of Science and Technology Rolla MO USA;

Missouri University of Science and Technology Rolla MO USA;

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原文格式 PDF
正文语种 eng
中图分类
关键词
Geometry; Inductance; Systematics; Shape; Layout; Impedance; Integrated circuit modeling;

机译：几何;电感;系统性;形状;布局;阻抗;集成电路建模;

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1. Decoupling capacitor power ground via layout analysis for multi-layered PCB PDNs [J] . Biyao Zhao, Shuang Liang, Samuel Connor, Electromagnetic Compatibility Magazine, IEEE . 2020,第3期

机译：通过多层PCB PDN的布局分析去耦电容器电源接地
2. Stochastic estimation of total radiated power from PCB signal/PDN layout using EMI radiation resistance [J] . Mehri Milad Microelectronics Journal . 2021,第Octa期

机译：使用EMI辐射电阻的PCB信号/ PDN布局总辐射电力的随机估计
3. PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models [J] . Pak J. S., Kim J., Cho J., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2011,第2期

机译：基于分离的P / G TSV和Chip-PDN模型的建议P / G TSV阵列模型对3D TSV IC的PDN阻抗建模和分析
4. Domain and modal decomposition for efficient signal and power integrity analysis of multilayer packages and PCBs [C] . Li Er-Ping, Liu En-Xiao Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International . 2012

机译：域和模态分解可对多层封装和PCB进行有效的信号和电源完整性分析
5. A Physics-Based Approach for Power Integrity in Multi-Layered PCBs [D] . Zhao, Biyao. 2017

机译：基于物理的多层PCB功率完整性方法
6. Bayesian Analysis of a Lipid-Based Physiologically Based Toxicokinetic Model for a Mixture of PCBs in Rats [O] . Alan F. Sasso, Panos G. Georgopoulos, Sastry S. Isukapalli, 2012

机译：大鼠体内多氯联苯混合物的基于脂质的生理毒理动力学模型的贝叶斯分析
7. Systematic Power Integrity Analysis Based on Inductance Decomposition in a Multi-Layered PCB PDN [O] . Biyao Zhao, Siqi Bai, Samuel Connor, 2020

机译：基于电感分解在多层PCB PDN中的系统功率完整性分析

Systematic Power Integrity Analysis Based on Inductance Decomposition in a Multi-Layered PCB PDN

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