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首页> 外文期刊>IEEE Electron Device Letters >Hot-carrier induced electron mobility and series resistance degradation in LDD NMOSFET's
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Hot-carrier induced electron mobility and series resistance degradation in LDD NMOSFET's

机译:LDD NMOSFET的热载流子感应电子迁移率和串联电阻退化

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摘要

The mobility and the series resistant degradation of LDD NMOSFET's were determined independently for the first time. Three device structures with different styles of drain engineering: 1) modestly doped LDD; 2) large-angle-tilt implanted drain, and 3) buried LDD were studied. We observed clearly that the series resistant drift dominates the initial device degradation and the relative importance of the mobility degradation increases as the stress time proceeds. Our work provides a useful guideline for device reliability optimization and for the development of the device degradation model for the circuit reliability simulation.
机译:首次独立确定了LDD NMOSFET的迁移率和串联电阻降级。三种具有不同漏极工程样式的器件结构:1)轻度掺杂LDD; 2)研究了大角度倾斜注入的漏极,以及3)埋入的LDD。我们清楚地观察到,串联电阻漂移主导了初始器件的退化,并且随着应力时间的延长,迁移率退化的相对重要性增加。我们的工作为器件可靠性优化和开发用于电路可靠性仿真的器件降级模型提供了有用的指导。

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