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首页> 外文期刊>Electronic Engineering Times >TI to break ground on $3 billion 300-mm Texas fab in '05
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TI to break ground on $3 billion 300-mm Texas fab in '05

机译：德州仪器（TI）将于05年在耗资30亿美元的300毫米德克萨斯州晶圆厂破土动工

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Richardson, Texas - Reaffirming the benefits of keeping research and design close to manufacturing, Texas Instruments Inc. plans a $3 billion fab here that will turn out 300-mm wafers on 65- and 45-nanometer design rules. Keeping design and manufacturing under the same umbrella is becoming more important as design rules shrink, Hans Stork, vice president of silicon technology development at TI, said. "The more difficult it is to scale the lithography―the more you have to use high-NA [numerical aperture] lenses and optical proximity correction―the more value exists in keeping process and design close together." Kevin Ritchie, senior vice president of manufacturing, said the Richardson fab is likely to start out with a "mini" line at 65-nm design rules, and then progress gradually to full capacity. The decision to name a site now is an indication that TI has "at least enough confidence to say that we want this capacity in place," Stork said pri- or to a press conference here last week. Tom Engibous, the chip maker's chairman and chief executive officer, said TI will break ground in this north Dallas suburb in 2005 and "slowly build up" production capacity at the 300-mm fab after it begins operations in 2007, eventually reaching 25,000 to 30,000 wafers per month of capacity.
机译：得克萨斯州理查森市（Richardson，Texas）-重申保持研究与设计接近制造的好处，德州仪器（TI）计划在这里投资30亿美元建造一座晶圆厂，该晶圆厂将按照65纳米和45纳米设计规则生产300毫米晶圆。 TI芯片技术开发副总裁Hans Stork表示，随着设计规则的缩小，将设计和制造置于同一​​伞下变得越来越重要。 “平版印刷术越困难，越需要使用高NA（数值孔径）透镜和光学邻近校正功能，在使工艺和设计紧密结合的过程中就越有价值。”制造高级副总裁凯文·里奇（Kevin Ritchie）表示，理查森（Richardson）的晶圆厂很可能会以65纳米设计规则的“迷你”生产线开始，然后逐步发展为满负荷生产。斯托克在上周的一次新闻发布会上说，现在决定命名站点的决定表明TI“至少有足够的信心说我们希望拥有这种能力”。芯片制造商董事长兼首席执行官汤姆·恩吉布斯（Tom Engibous）表示，TI将于2005年在达拉斯北部郊区破土动工，并于2007年开始运营后“缓慢地建立” 300毫米晶圆厂的生产能力，最终达到25,000至30,000晶圆每月产能。

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