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Development of an orientation-dependent anisotropic etching simulations system MICROCAD

机译:开发与方向相关的各向异性蚀刻模拟系统MICROCAD

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摘要

As a tool to support the fabrication process design of micromachine devices with complicated three-dimensional (3D)configurations, a crystal orientation-dependent aniso- tropic etching analysis system called MICROCAD has been developed. This system has the capability to analyze the time variations of the 3D etching profile for an arbitrary mask pattern, by preparing in all directions as a database. The measurement method of the etching rate in all direc- Tions, the configuration of the analysis system, and the Computational method for the 3D etching profile are de- Scribed.
机译:作为支持具有复杂的三维(3D)配置的微机械设备的制造工艺设计的工具,已经开发了一种称为MICROCAD的依赖于晶体取向的各向异性蚀刻分析系统。该系统具有通过将所有方向准备为数据库来分析任意掩模图案的3D蚀刻轮廓的时间变化的功能。描述了所有方向上蚀刻速率的测量方法,分析系统的配置以及3D蚀刻轮廓的计算方法。

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