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Textural and thermal conductivity properties of a low density mesoporous silica material

机译：低密度介孔二氧化硅材料的质构和导热性能

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摘要

In this study, the pore structure, tapped density and thermal conductivity properties of a new type of nanoporous silica material have been studied. We have applied nitrogen physisorption, high resolution scanning microscopy and Transient Plane Source rhermal conductivity measurements to investigate these properties. The new mesoporous silica SNP have large BET surface area, 400-439 m~2 g~(-1) and possess high porosity in the range of 95-97%. The results further show pore diameter centred at 43 nm or 47 nm for the two materials studied. Tapped densities as low as 0.077 g/cm~3 have so far been obtained and the thermal conductivity of these materials has been measured to 0.0284 and 0.0294 W (m K)~(-1) at room temperature and atmospheric pressure. The effects of tapped density, pore size diameter and particle morphology on thermal conductivity are discussed.
机译：在这项研究中，已经研究了新型纳米多孔二氧化硅材料的孔结构，堆积密度和导热性能。我们已经应用氮物理吸附，高分辨率扫描显微镜和瞬态平面源热导率测量来研究这些特性。新型介孔二氧化硅SNP的BET表面积大，为400-439 m〜2 g〜（-1），孔隙率在95-97％之间。结果进一步表明，所研究的两种材料的孔径集中在43 nm或47 nm。到目前为止，已经获得了低至0.077 g / cm〜3的堆积密度，并且在室温和大气压下，这些材料的热导率已测量为0.0284和0.0294 W（m K）〜（-1）。讨论了堆积密度，孔径直径和颗粒形态对热导率的影响。

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