...
  • 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Energy and Buildings >Improving the thermal transmittance of single-brick walls built of clay bricks lightened with paper pulp
【24h】

Improving the thermal transmittance of single-brick walls built of clay bricks lightened with paper pulp

机译：提高纸浆减轻的粘土砖建造的单砖砌墙的传热性

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

One of the most important factors in the thermal behavior of exterior walls is the thermal conductivity of the clay in their bricks. The higher the percentage of lightening additives incorporated, the better the thermal behavior of the bricks. But as their thermal characteristics are improved the mechanical properties of bricks deteriorate. The goal is to study the influence of paper pulp as a lightening additive on the thermal and mechanical properties of the fired clay, and to improve the thermal properties as far as possible without the mechanical properties falling below the required levels. This involved the preparation of test specimens that were then subjected to the corresponding assays of thermal conductivity and mechanical strength. It is found that around 15% of paper pulp can be added without the brick's mechanical properties ceasing to comply with current legislation. This amount of paper pulp has improved conductivity properties by 39.69% compared to the clay without additives, recording a minimum conductivity value at 10℃ of 0.45W/m-K. This decrease in the conductivity of the clay results in a 16% improvement in equivalent thermal transmittance for brick walls made in the same way.
机译：外墙热行为中最重要的因素之一是砖中粘土的导热性。掺入的增亮添加剂的百分比越高，砖的热性能越好。但是随着其热特性的改善，砖的机械性能下降。目的是研究纸浆作为增白剂对煅烧粘土的热和机械性能的影响，并尽可能提高热性能，而机械性能不低于要求的水平。这涉及测试样品的制备，然后对其进行热导率和机械强度的相应测定。发现可以添加约15％的纸浆，而砖的机械性能不再符合现行法规。与不含添加剂的粘土相比，此纸浆的导电性能提高了39.69％，在10℃时记录的最小导电值为0.45W / m-K。粘土的电导率的这种降低导致以相同方式制造的砖墙的等效导热率提高了16％。

著录项

  • 来源
    《Energy and Buildings》 |2013年第4期|171-180|共10页
  • 作者

    P.Munoz; M.C.Juarez; M.P.Morales; M.A. Mendivil;

  • 作者单位

    Escuela Tecnica Superior de Ingenieria Industrial. Universidad de La Rioja, Calle Luis de Ulloa, 20,26004-LogroHo, La Rioja, Spain;

    Escuela Tecnica Superior de Ingenieria Industrial. Universidad de La Rioja, Calle Luis de Ulloa, 20,26004-LogroHo, La Rioja, Spain;

    Universidad Autonoma de Chile, Pedro de Valdivia 641-Providencia, Santiago, Chile;

    Escuela Tecnica Superior de Ingenieria Industrial. Universidad de La Rioja, Calle Luis de Ulloa, 20,26004-LogroHo, La Rioja, Spain;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    lightweight clay; thermal conductivity; compressive breaking stress; paper pulp; thermal transmittance;

    机译：轻质粘土导热系数;压缩断裂应力;纸浆;导热率;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号