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Solving electromagnetic scattering from complex composite objects with domain decomposition method based on hybrid surface integral equations

机译:基于混合表面积分方程的区域分解法求解复杂复合物的电磁散射

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摘要

A new domain decomposition method (DDM) is proposed to solve the electromagnetic scattering from microstrip antennas and arrays conformally mounted on a perfect electrically conducting (PEC) platform. Based on the local geometrical structures and material properties, the complex composite structures is first decomposed into independent sub-domains, following the philosophy of divide and conquer. The combined field integral equation (CFIE), the electric field integral equation (EFIE), and the Poggio-Miller-Chang-Harrington-Wu-Tsai (PMCHWT) formulation are then combined seamlessly in the framework of DDM. These equations are applied for different sub-domains: CFIE is used for the platform (closed PEC) sub-domains and EFIE-PMCHWT is employed for the microstrip (composite structure with dielectric substrate and open PEC sheet) sub-domains. To ensure the continuities of fields, the transmission conditions (TCs) are applied on the touching-faces. Compared with the traditional method, the newly developed DDM not only releases the burden of geometry preparation, but also results in a better conditioned matrix.
机译:提出了一种新的域分解方法(DDM),以解决微带天线和共形安装在理想导电(PEC)平台上的阵列的电磁散射。根据局部几何结构和材料特性,首先按照分而治之的原理将复杂的复合结构分解为独立的子域。然后在DDM框架中将组合场积分方程(CFIE),电场积分方程(EFIE)和Poggio-Miller-Chang-Harrington-Wu-Tsai(PMCHWT)公式无缝组合。这些方程式适用于不同的子域:CFIE用于平台(封闭的PEC)子域,而EFIE-PMCHWT用于微带(具有介电基板和开放PEC片的复合结构)子域。为了确保场的连续性,将传输条件(TC)应用于触摸面上。与传统方法相比,新开发的DDM不仅减轻了几何准备的负担,而且还产生了更好的条件矩阵。

著录项

  • 来源
    《Engineering analysis with boundary elements》 |2017年第12期|99-104|共6页
  • 作者单位

    Key Laboratory of Intelligent Computing and Signal Processing, Ministry of Education, Anhui University, Hefei, Anhui 230039, China;

    Key Laboratory of Intelligent Computing and Signal Processing, Ministry of Education, Anhui University, Hefei, Anhui 230039, China;

    School of Electronic Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China;

    School of Electronic Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Microstrip structures; Platform; Hybrid equations; DDM;

    机译:微带结构;平台;混合方程DDM;

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