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首页> 外文期刊>IEE Proceedings. Part J >Design and fabrication of packaged InP/InGaAsP multiple quantum well waveguide components with very low insertion loss
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Design and fabrication of packaged InP/InGaAsP multiple quantum well waveguide components with very low insertion loss

机译:具有极低插入损耗的封装式InP / InGaAsP多量子阱波导组件的设计与制造

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摘要

The design of a multiple quantum well (MQW) waveguide with low fibre-to-fibre loss, suitable for optoelectronic device integration, is described. The devices were grown by atmospheric pressure MOVPE and designed to be matched to standard, lensed optical fibre. Measured propagation loss was (0.75+or-0.1) dB cm/sup -1/ with a fibre-to-fibre loss of (2.6+or-0.1) dB. Analysis shows that the coupling loss due to mode mismatch was less than (0.52+or-0.14) dB/facet, believed to be the lowest reported coupling loss to a semiconductor waveguide using lensed fibre. A device packaged using laser welding to fix the fibres had a total insertion loss of (3.9+or-0.1) dB giving less than 1.3 dB excess loss due to the packaging process.
机译:描述了适用于光电子设备集成的低光纤到光纤损耗的多量子阱(MQW)波导的设计。这些设备是通过大气压MOVPE生长的,并设计为与标准的透镜光纤匹配。测得的传播损耗为(0.75+或-0.1)dB cm / sup -1 /,光纤到光纤的损耗为(2.6+或-0.1)dB。分析表明,由于模式失配引起的耦合损耗小于(0.52+或-0.14)dB /小平面,据认为这是使用透镜光纤到半导体波导的最低报告耦合损耗。使用激光焊接固定光纤的设备的总插入损耗为(3.9+或-0.1)dB,由于封装过程而导致的额外损耗小于1.3 dB。

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