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Specimen aligning techniques in tensile and fatigue tests for thin films

机译：薄膜拉伸和疲劳测试中的试样对准技术

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摘要

Measurements of the mechanical properties of a thin film are strongly influenced by the test procedures. The aim of this paper is to introduce specimen aligning techniques for tensile and fatigue tests with thin films. The calculated modulus for polycrystalline silicon can vary from 100 to 160 GPa according to the alignment condition and reaches a peak at the best alignment as determined from an extensive pre-tensile test. The 'modulus alignment method' is utilized to ensure the specimen alignment before doing tensile and fatigue tests based on the fact that the better the alignment, the higher the modulus. In addition to that, a closed loop control scheme is applied during a fatigue test to maintain the constant load. An S-N curve for polysilicon film is obtained and compared with the results of other researchers.
机译：薄膜机械性能的测量受到测试程序的强烈影响。本文的目的是介绍用于薄膜拉伸和疲劳测试的试样对准技术。多晶硅的计算模量可根据对准条件在100至160 GPa之间变化，并根据广泛的预拉伸测试确定，在最佳对准时达到峰值。基于“对齐方式越好，模量越高”这一事实，采用“模量对齐方式”来确保样品在进行拉伸和疲劳测试之前对齐。除此之外，在疲劳测试期间采用闭环控制方案以保持恒定负载。获得了多晶硅膜的S-N曲线，并将其与其他研究人员的结果进行了比较。

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