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Pool Boiling Enhancement through Graphene and Graphene Oxide Coatings

机译：通过石墨烯和氧化石墨烯涂层增强熔池沸腾

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摘要

Boiling has served as an effective means to dissipate large quantities of heat over small areas. Graphene, a two-dimensional material, has garnered significant attention of researchers due to its excellent thermal properties. In this study, copper test chips are dip coated with a solution consisting of graphene oxide and graphene and its pool boiling performance with distilled water at atmospheric pressure was investigated. The surfaces were characterized using X-ray diffraction, Fourier transform infrared spectroscopy, thermogravimetric analysis, and scanning electron microscopy which confirmed the presence of graphene and graphene oxide. The contact angles measured on the coated surfaces indicated hydrophobic wetting behavior. Four heat transfer surfaces were prepared with dip coating durations of 120 s, 300 s, 600 s, and 1200 s, respectively. A Critical Heat Flux (CHF) of 182 W/cm~2 and a heat transfer coefficient (HTC) of 96 kW/m~2 ℃ was obtained with the shortest coating duration which translated to an enhancement of 42% in CHF and 47% in HTC when compared to a plain uncoated surface under similar conditions. Contact angle changes were not seen to be responsible, although roughness was seen as an influencing factor contributing to the enhancement. Further studies are needed to explain the enhancement mechanism.
机译：沸腾已成为在小区域散发大量热量的有效手段。石墨烯是一种二维材料，因其出色的热性能而受到了研究人员的广泛关注。在这项研究中，铜测试芯片浸涂了由氧化石墨烯和石墨烯组成的溶液，并研究了其在常压下与蒸馏水的池沸腾性能。使用X射线衍射，傅里叶变换红外光谱，热重分析和扫描电子显微镜对表面进行表征，这证实了石墨烯和氧化石墨烯的存在。在涂覆表面上测得的接触角表明疏水润湿行为。制备四个传热表面，浸涂时间分别为120 s，300 s，600 s和1200 s。获得的临界热通量（CHF）为182 W / cm〜2，传热系数（HTC）为96 kW / m〜2℃，涂覆时间最短，这意味着CHF的增加为42％，涂层的增加为47％与HTC在相似条件下与普通无涂层表面进行比较尽管粗糙度被认为是有助于提高接触角的一个因素，但接触角的变化并不被认为是负责任的。需要进一步的研究来解释增强机制。

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  • 来源
    《Heat Transfer Engineering》 |2017年第15期|1274-1284|共11页
  • 作者

    Arvind Jaikumar; Satish G. Kandlikar; Anju Gupta;

  • 作者单位

    Microsystems Engineering Department, Rochester Institute of Technology, Rochester, NY, USA;

    Microsystems Engineering Department, Rochester Institute of Technology, Rochester, NY, USA,Mechanical Engineering Department, Rochester Institute of Technology, Rochester, NY, USA;

    Chemical Engineering Department, Rochester Institute of Technology, Rochester, NY, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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