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首页> 外文期刊>Heat Transfer Engineering >Nucleate Boiling Enhancements on Porous Graphite and Microporous and Macro-Finned Copper Surfaces
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Nucleate Boiling Enhancements on Porous Graphite and Microporous and Macro-Finned Copper Surfaces

机译:多孔石墨以及微孔和大尺寸铜表面上的核沸腾增强

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摘要

Enhancements in nucleate boiling heat removal with dielectric liquids, by increasing either the bubbles nucleation sites density and/or the wetted surface area, are desirable for immersion cooling of high-power computer chips. This article presents the results of recent investigations of nucleate boiling enhancement of FC-72, HFE-7100, and PF-5060 dielectric liquids on porous graphite, copper microporous surfaces, and copper surfaces with square corner pins, 3 mm × 3 mm in cross-section and 2, 3, and 5 mm tall. All surfaces have a footprint measuring 10 × 10 mm. These investigations examined the effects of liquid subcooling up to 30 K and surface inclination, from upward-facing to downward-facing, on nucleate boiling heat transfer coefficient and critical heat flux. Natural convection of dielectric liquids for cooling chips while in the stand-by mode, at a surface average heat flux <20 kW/m~2, is also investigated for the different surfaces.
机译:对于大功率计算机芯片的浸入式冷却,通过增加气泡成核位点密度和/或润湿的表面积来增强利用介电液体的成核沸腾除热是理想的。本文介绍了最近在多孔石墨,铜微孔表面和带有方形角销(横截面为3 mm×3 mm)的铜表面上对FC-72,HFE-7100和PF-5060电介质液体进行核沸腾增强研究的结果截面,2、3和5毫米高。所有表面的占地面积均为10×10 mm。这些研究检查了高达30 K的液体过冷和表面倾斜度(从上到下)对成核沸腾传热系数和临界热通量的影响。还研究了用于冷却芯片的介电液体在待机模式下在表面平均热通量<20 kW / m〜2时的自然对流情况,适用于不同表面。

著录项

  • 来源
    《Heat Transfer Engineering》 |2012年第3期|p.175-204|共30页
  • 作者

    MOHAMED S. EL-GENK;

  • 作者单位

    Institute for Space and Nuclear Power Studies, Chemical and Nuclear Engineering Department, and Mechanical Engineering Department, University of New Mexico, Albuquerque, New Mexico, USA Department of Chemical and Nuclear Engineering, University of New Mexico, Albuquerque,NM 87131-0001, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    C: coefficient; CHF: critical heat flux (W/cm~2); CHFR: CHF ratio, CHF_(sub)sub/ CHF_(sat); CNT: carbon nanotube; c_u: Copper; et al;

    机译:C:系数;CHF:临界热通量(W / cm〜2);CHFR:瑞士法郎比率;CHF_(sub)sub / CHF_(sat);CNT:碳纳米管;c_u:铜;等;

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