Embedded transmission line MMIC 1-W flip chip assembly using a Z-axis interconnect

Budka T.; Ketterson A.

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Embedded transmission line MMIC 1-W flip chip assembly using a Z-axis interconnect

机译：使用Z轴互连的嵌入式传输线MMIC 1-W倒装芯片组件

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The authors describe a new type of electronic packaging topology using embedded transmission-line (ETL) monolithic microwave integrated circuits (MMIC's) along with a new state-of-the-art Z-axis material that acts as a chip adhesive as well as an electrical connection with a carrier substrate. The results from the first two flip chip assemblies that were produced under the Microwave Analog Front End Technology (MAFET) Thrust 2 Program are presented. The flip chip packages provided greater than 1-W package output power on a Kovar housing floor with greater than 8-dB package large signal gain at 11.5 GHz.

机译：作者介绍了一种新型的电子封装拓扑结构，该结构使用嵌入式传输线（ETL）单片微波集成电路（MMIC）以及一种新型的最新Z轴材料（用作芯片粘合剂）以及一种与载体基板的电连接。介绍了在微波模拟前端技术（MAFET）推力2程序下生产的前两个倒装芯片组件的结果。倒装芯片封装在Kovar外壳上提供了大于1W的封装输出功率，在11.5 GHz时具有大于8dB的封装大信号增益。

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《IEEE Microwave and Guided Wave Letters》 |1998年第6期|P.238-240|共3页
作者
Budka T.; Ketterson A.;
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正文语种 eng
中图分类无线电电子学、电信技术;
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2. Millimeter-WaVe Flip-Chip MMIC Structure with High Performance and High Reliability Interconnects [J] . Masaharu ITO, Kenichi MARUHASHI, Hideki KUSAMITSU IEICE Transactions on Electronics . 1999,第11期

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3. A flip-chip MMIC design with coplanar waveguide transmission line in the W-band [J] . Hirose T., Makiyama K. IEEE Transactions on Microwave Theory and Techniques . 1998,第12期

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5. Investigation of tractable models of coupling between MMICs in multi-chip assemblies. [D] . Wang, Zhaoyang. 2001

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6. Novel First-Level Interconnect Techniques for Flip Chip on MEMS Devices [O] . Jemmy Sutanto, Sindhu Anand, Chetan Patel, -1

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7. Flip chip and tab interconnects for millimeter wave MMICs - A comprehensive study [O] . Dravet Alain, Desplan Didier, Haese Nathalie, 1998

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8. Reliability assessment of advanced flip-chip interconnect electronic package assemblies under extreme cold temperatures (-190 degrees C and -120 degrees C) [R] . Ramesham, Rajeshuni, Ghaffarian, Reza, Shapiro, Andrew, 2005

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Embedded transmission line MMIC 1-W flip chip assembly using a Z-axis interconnect

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