Mutual coupling between grounded bonding wires for high density IC packaging has been characterized over a wide frequency range using the Method of Moments in consideration of the ohmic and radiation losses. At high frequencies, the mutual inductance greatly increases due to the radiation-enhanced mutual coupling effect. For 500-/spl mu/m-long bonding wires, a minimum 200-/spl mu/m separation is required to maintain a 20-dB crosstalk level at low frequencies. This wideband analysis will be useful for designing packages and interconnection layouts of high frequency ICs with increased packaging density and operating frequency.
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