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首页> 外文期刊>Electronics Packaging Manufacturing, IEEE Transactions on >Tin Whisker Test Development—Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection
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Tin Whisker Test Development—Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection

机译：锡晶须测试开发—温度和湿度影响第一部分：实验设计，观察和数据收集

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The effects of temperature and humidity on tin whisker growth were investigated through a collaborative project sponsored by the International Electronics Manufacturing Initiative (iNEMI) and its member companies. A broad range of testing conditions was adopted to test a variety of components with matte tin (Sn) plating and copper (Cu)-based leadframes. The primary goal of the study was to collect data that could be used to develop mathematical models (acceleration functions) that describe the dependence of tin whisker growth and corrosion on temperature and humidity. This paper describes the background, experimental design, data collection and reports results. Part II of the study (J. W. Osenbach et a. ?Tin whisker test development-Temperature and humidity effects part II: Acceleration model development,? Electronics Packaging Manufacturing, Vol. 33, no. 1, pp., Jan. 2010) discusses in the data analyses and acceleration model development. Storage testing was performed over a wide range of temperature and humidity conditions from 30?C to 100?C and from 10% to 90% relative humidity (RH). Commercially produced components with both 3 ?m and 10 ?m thicknesses from three sources were evaluated. For components with the 10 ?m-plating, the plating was evaluated in both the as-plated and reflowed (260?C) conditions. These variations resulted in a large experimental matrix that included 13 different Sn platings, aged at ten different temperature and humidity combinations. Further, the aging test was done at five different laboratories with inspections performed at eight different laboratories. The data collected include 1) corrosion incubation time, 2) tin whisker incubation time, and 3) dependence of the maximum whisker length on storage time at each temperature/humidity condition. Data suggest that corrosion is not a unique driving force for whisker initiation and growth. Whisker formation differs in corroded and non-corroded regions. Due to the scope of this work, it is br-noken down into two papers. The data and experimental observations are discussed in this paper. The mathematical model development, discussion of results and conclusions are included in Part II of this study.
机译：通过国际电子制造倡议组织（iNEMI）及其成员公司赞助的合作项目，研究了温度和湿度对锡晶须生长的影响。采用了广泛的测试条件，以使用雾锡（Sn）电镀和铜（Cu）引线框测试各种组件。该研究的主要目的是收集可用于开发描述锡晶须生长和腐蚀对温度和湿度的依赖性的数学模型（加速函数）的数据。本文介绍了背景，实验设计，数据收集和报告结果。研究的第二部分（JW Osenbach等人，“锡晶须测试开发－温度和湿度影响，第二部分：加速模型开发”，《电子包装制造》，第33卷，第1期，第pp，2010年1月）进行了讨论。数据分析和加速模型开发。在30°C至100°C和10％至90％相对湿度（RH）的温度和湿度条件下进行存储测试。评估了来自三个来源的厚度分别为3？m和10？m的商业生产组件。对于镀层为10？m的组件，在镀层和回流（260°C）条件下都对镀层进行了评估。这些变化导致了一个大型的实验矩阵，其中包括13种不同的Sn镀层，并在十种不同的温度和湿度组合下进行了时效处理。此外，老化测试是在五个不同的实验室进行的，并在八个不同的实验室进行了检查。收集的数据包括1）腐蚀温育时间，2）锡晶须培养时间以及3）在每个温度/湿度条件下最大晶须长度与储存时间的相关性。数据表明，腐蚀并不是晶须引发和生长的唯一驱动力。晶须的形成在腐蚀和未腐蚀区域有所不同。由于这项工作的范围，它分为两篇。本文讨论了数据和实验观察。数学模型的开发，结果的讨论和结论都包含在本研究的第二部分中。

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