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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Processing and reliability of fast-flow, snap-cure underfills. I. Processing and moisture sensitivity
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Processing and reliability of fast-flow, snap-cure underfills. I. Processing and moisture sensitivity

机译：快速流动，快速固化的底部填充的加工性和可靠性。 I.加工和湿度敏感性

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摘要

This series of articles studies the processing, moisture sensitivity, reliability, and failure mode analysis of a number of commercial fast-flow, snap-cure underfill materials. It includes data on process analysis, processing times, and reliability of the test vehicles in air-to-air thermal cycling (-55/spl deg/C to 125/spl deg/C), liquid to liquid thermal shock (-55/spl deg/C to 125/spl deg/C), and J Standard 020 Revision A Level 3 Moisture Sensitivity Preconditioning followed by reliability testing. Samples cured using a second reflow pass are compared to baseline samples cured in a standard batch oven based on the underfill manufacturer's recommended cure schedule. Results from the processing of these new materials have shown a greatly reduced flow time from earlier generation underfill materials as all of these materials had flow times of less than 30 s under 5-mm test die. Through differential scanning calorimetry analysis, it was shown that materials requiring less than 8 min to cure exhibited at least 95% conversion (percentage of material cured) through the modified second side renew profile. Some of these commercial underfills have also passed J Standard 020 Revision A Level 3 Moisture Sensitivity testing. Specifically in this paper, the flip chip processing, underfill processing, moisture preconditioning, and preconditioning failure modes are presented.
机译：该系列文章研究了许多商业快速流动，快速固化的底部填充材料的加工，湿度敏感性，可靠性和失效模式分析。它包含有关过程分析，处理时间和测试车辆在空对空热循环（-55 / spl deg / C至125 / spl deg / C），液-液热冲击（-55 / spl deg / C至125 / spl deg / C），以及J标准020修订版A级别3湿度敏感性预处理，然后进行可靠性测试。根据底部填充制造商建议的固化时间表，将使用第二次回流焊固化的样品与在标准分批炉中固化的基线样品进行比较。这些新材料的加工结果表明，与上一代底部填充材料相比，流动时间大大缩短，因为所有这些材料在5毫米测试模具下的流动时间均小于30 s。通过差示扫描量热分析，表明需要少于8分钟的固化时间的材料通过改进的第二面更新剖面显示至少95％的转化率（固化材料的百分比）。这些商用底部填充胶中的一些还通过了J Standard 020修订版A Level 3湿敏性测试。具体来说，本文介绍了倒装芯片处理，底部填充处理，水分预处理和预处理失败模式。

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