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首页> 外文期刊>IEEE transactions on nanotechnology >Mushroom-Shaped Micropillars for Robust Nonwetting Surface by Electrohydrodynamic Structuring Technique
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Mushroom-Shaped Micropillars for Robust Nonwetting Surface by Electrohydrodynamic Structuring Technique

机译：电动稳固技术在蘑菇形微柱上形成坚固的不润湿表面

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摘要

Mushroom-shaped micropillars (MSMPs) have a unique microscopic shape that is suitable to produce a highly robust nonwetting surface. This commercially important property is possible thanks to the specific overhang shape, which has a larger tip diameter than the shaft below. We fabricated such a textured surface using poly(methyl methacrylate) (PMMA) via electrohydrodynamic structuring technique. The method combines hot embossing, electrically induced growth, and electrowetting. Even though PMMA itself is hydrophilic (the intrinsic contact angle is 82°), its modified surface is hydrophobic with an apparent contact angle of 152°. We also studied the robustness of the nonwetting surface by comparing the difference between the static contact angles before and after the samples had been submerged in water. Our results show that only the surface structured with the 43-μm tip-diameter MSMPs (the largest size) can successfully maintain its highly nonwetting property. Because of the large fabrication potential of the MSMPs with a large tip diameter, the described surface structuring technique is a promising candidate for the mass production of artificial and sufficiently robust nonwetting surfaces.
机译：蘑菇形微柱（MSMP）具有独特的微观形状，适合于产生高度坚固的不润湿表面。由于具有特定的悬垂形状，因此具有重要的商业意义，该悬垂形状的末端直径比下方的轴大。我们通过电流体动力学结构技术使用聚甲基丙烯酸甲酯（PMMA）制作了这样的纹理表面。该方法结合了热压花，电致生长和电润湿。即使PMMA本身是亲水的（固有接触角为82°），其改性表面仍是疏水的，表观接触角为152°。我们还通过比较样品浸入水中之前和之后的静态接触角之间的差异，研究了非润湿表面的坚固性。我们的结果表明，只有具有43μm尖端直径MSMP（最大尺寸）的结构表面才能成功保持其高度不润湿的性能。由于具有大尖端直径的MSMP具有巨大的制造潜力，因此所描述的表面结构化技术是批量生产人工且足够坚固的非润湿表面的有希望的候选者。

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