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首页> 外文期刊>IEEE Transactions on Semiconductor Manufacturing >Systems of multiple cluster tools: configuration, reliability, and performance
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Systems of multiple cluster tools: configuration, reliability, and performance

机译：多个集群工具的系统：配置，可靠性和性能

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The migration of semiconductor processes to single-wafer vacuum cluster tools has rendered configuration an important decision variable in fab operation and heightened the impact of reliability on fab performance. We address these closely linked issues by deriving the optimal configuration and operation of systems of cluster tools in the presence of scheduled maintenance. The two extremes in the spectrum of possible configurations are the serial configuration, in which the modules in a tool are all different, each representing a step in a process sequence, and the parallel configuration, in which each tool is assigned only one process step. We predict that the latter can offer higher throughputs. However, this advantage may be slight when equipment downtime is relatively schedulable and infrequent, in which the case the serial configuration may be preferable because of its superior cycle times. We also derive optimal lot sizing and release policies for systems of cluster tools. We conclude that fabs will gradually migrate from parallel configurations to serial as cluster tools become more reliable and cycle time becomes more important.
机译：半导体工艺向单晶圆真空簇工具的迁移已使配置成为晶圆厂运营中的重要决策变量，并提高了可靠性对晶圆厂性能的影响。我们通过在计划维护的情况下获得集群工具系统的最佳配置和操作来解决这些紧密联系的问题。可能的配置范围中的两个极端是串行配置和并行配置，在串行配置中，工具中的模块都不同，每个模块代表一个过程序列中的一个步骤；在并行配置中，每个工具仅分配一个过程步骤。我们预测后者可以提供更高的吞吐量。但是，当设备停机时间相对可计划且不经常发生时，此优势可能很小，在这种情况下，由于其优越的周期时间，串行配置可能更可取。我们还为集群工具系统导出了最佳的批量确定和发布策略。我们得出的结论是，随着群集工具变得更加可靠并且周期时间变得越来越重要，晶圆厂将逐渐从并行配置迁移到串行。

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