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首页> 外文期刊>IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control >Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays
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Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays

机译：大面积和小间距二维超声换能器阵列的包装和模块化组装

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摘要

A promising transducer architecture for largearea arrays employs 2-D capacitive micromachined ultrasound transducer (CMUT) devices with backside trench-frame pillar interconnects. Reconfigurable array (RA) application-specified integrated circuits (ASICs) can provide efficient interfacing between these high-element-count transducer arrays and standard ultrasound systems. Standard electronic assembly techniques such as flip-chip and ball grid array (BGA) attachment, along with organic laminate substrate carriers, can be leveraged to create large-area arrays composed of tiled modules of CMUT chips and interface ASICs. A large-scale, fully populated and integrated 2-D CMUT array with 32 by 192 elements was developed and demonstrates the feasibility of these techniques to yield future large-area arrays. This study demonstrates a flexible and reliable integration approach by successfully combining a simple under-bump metallization (UBM) process and a stacked CMUT/interposer/ASIC module architecture. The results show high shear strength of the UBM (26.5 g for 70-μm balls), high interconnect yield, and excellent CMUT resonance uniformity (s = 0.02 MHz). A multi-row linear array was constructed using the new CMUT/interposer/ASIC process using acoustically active trench-frame CMUT devices and mechanical/ nonfunctional Si backside ASICs. Imaging results with the completed probe assembly demonstrate a functioning device based on the modular assembly architecture.
机译：大面积阵列的一种有前途的换能器架构采用带有背面沟槽框架支柱互连的二维电容微机械超声换能器（CMUT）器件。可重配置阵列（RA）应用指定的集成电路（ASIC）可以在这些高元素数换能器阵列和标准超声系统之间提供有效的接口。可以利用诸如倒装芯片和球栅阵列（BGA）附件之类的标准电子组装技术，以及有机层压基板载体，来创建由CMUT芯片和接口ASIC的平铺模块组成的大面积阵列。开发了具有32 x 192元素的大规模，完全填充和集成的2-D CMUT阵列，并证明了这些技术在生产未来大面积阵列中的可行性。这项研究通过成功地将简单的凸点下金属化（UBM）工艺与堆叠式CMUT /中介层/ ASIC模块架构相结合，展示了一种灵活而可靠的集成方法。结果表明，UBM具有较高的剪切强度（对于70-μm的球为26.5 g），较高的互连成品率和出色的CMUT共振均匀性（s = 0.02 MHz）。使用声有源沟槽框架CMUT器件和机械/非功能性Si背面ASIC，使用新的CMUT /中介层/ ASIC工艺构造了多行线性阵列。完成的探头组件的成像结果证明了基于模块化组件架构的功能性设备。

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