• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control >Manufacturing of prestressed piezoelectric unimorphs using a postfired biasing layer
【24h】

Manufacturing of prestressed piezoelectric unimorphs using a postfired biasing layer

机译：使用后烧偏压层制造预应力压电单压电晶片

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

A novel manufacturing method for prestressed piezoelectric unimorphs is introduced and the actuator properties are examined. Prestressed PZT 5A and PZT 5H unimorphs with piezo material thickness of 250 /spl mu/m and 375 /spl mu/m were manufactured by using sintering and thermal shrinkage of the prestressing material. The process was carried out by screen printing a layer of AgPd paste on one side of the sintered bulk ceramic. As an alternative method, dielectric low temperature co-fired ceramic (LTCC) tape was used as the prestressing material. Different configurations were tested to obtain high displacements and to make a comparison between materials. After firing, the samples were poled, and the displacement versus load characteristics of the resulting actuators were investigated. A maximum displacement of 118 /spl mu/m was obtained from a 250 /spl mu/m thick, prestressed PZT 5H actuator with a diameter of 25 mm, in which LTCC tape was used as the prestressing layer. Similarly, the PZT 5H material provided a maximum displacement of 63 /spl mu/m with a screen-printed AgPd prestressing layer. The manufacturing method described offers a novel approach for the production of a wide range of integrated active structures on, for instance, an LTCC circuit board. This is especially important because piezoelectric bulk materials with high piezoelectric coefficients can be used to produce high displacements.
机译：介绍了一种用于预应力压电单压电晶片的新型制造方法，并研究了执行器的性能。通过使用预应力材料的烧结和热收缩，制造压电材料厚度为250 / spl mu / m和375 / spl mu / m的预应力PZT 5A和PZT 5H单晶硅。通过在烧结的块状陶瓷的一侧上丝网印刷一层AgPd糊剂来执行该过程。作为一种替代方法，使用介电低温共烧陶瓷（LTCC）胶带作为预应力材料。测试了不同的配置以获得高位移并在材料之间进行比较。烧制后，将样品极化，并研究所得致动器的位移与负载特性。从直径为25 mm的250 / spl mu / m厚的预应力PZT 5H执行器中获得最大118 / spl mu / m的位移，其中LTCC带用作预应力层。同样，PZT 5H材料通过丝网印刷的AgPd预应力层提供的最大位移为63 / spl mu / m。所述的制造方法提供了一种新颖的方法，用于在例如LTCC电路板上生产各种集成的有源结构。这一点特别重要，因为具有高压电系数的压电块状材料可用于产生高位移。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号