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首页> 外文期刊>IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control >Thermal transient model of a crystal resonator employingthickness-shear vibrations
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Thermal transient model of a crystal resonator employingthickness-shear vibrations

机译：厚度剪切振动的晶体谐振器热瞬态模型

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摘要

This paper presents an improved model of thermally inducednfrequency transients in vacuum-enclosed thickness-shear mode quartzncrystal resonators. The response times to temperature changes forndifferent parts of the resonator and resulting thermal dynamicncoefficients are examined and are related to Ballato's coefficientnthrough a function defined by the resonator design, dependent on thermalnresponse times only. A method is worked out for response timencalculations for the different contributions to the static and dynamicntemperature behavior of general and anharmonic modes. The model has beennused to examine thermally induced frequency transients of the AT-cutnresonator h513 anharmonic mode excited by the modulationalnmethod within an ovenized Colpitts oscillator. A good agreement is shownnbetween the predicted curves and experimental data over a variety ofntemperature ranges
机译：本文提出了一种改进的真空封闭厚度剪切模式石英晶体谐振器中的热感应频率瞬变模型。检查谐振器不同部分对温度变化的响应时间以及由此产生的热力学系数，并通过谐振器设计定义的函数将其与Ballato系数相关，该函数仅取决于热响应时间。提出了一种响应时间的计算方法，以求出对一般和非谐模式的静态和动态温度行为的不同贡献。该模型已被采用以检查AT-cutnresonator h513非谐波模式的热感应频率瞬变，该模式由烤箱化的Colpitts振荡器中的调制方法激发。在不同温度范围内的预测曲线与实验数据之间显示出良好的一致性

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