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ProFood Tech 2019: Industry confirms call for a central platform for suppliers of the food industry in the USA

机译:ProFood Tech 2019:工业界确认要求为美国食品工业供应商提供中央平台

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Following the successful premiere in April of this year, ProFood Tech is once again picking up speed for 2019. The trade fair in Chicago had already underlined its importance as a central industry platform for suppliers of the food and beverage processing industry in North America with the first event. The trade fair format of ProFood Tech was conceived of by Koelnmesse GmbH, PMMl: The Association for Packaging and Processing Technologies and the International Dairy Foods Association (IDFA), together with the industry and following the model of leading Cologne trade fairs. The event addresses the call of many years from the industry for a single, central and strong trade platform in the USA. It gathers the supply and the demand in the food processing branch across all industry segments on the American continent every two years. The next ProFood Tech will take place from 26-28 March 2019 on the Mccormick Place fair grounds in Chicago. The plans are being further developed in a dialogue with the industry in order to precisely suit the requirements of the NAFTA market. The high quality exhibitor advisory board, with big market players like Tetra Pak, GEA, Harpak-ULMA Packaging, Serac and others bundles the interests of the exhibitors and represents these in the conceptualisation of the trade fair.
机译:继今年4月成功首播之后,ProFood Tech再次提高了2019年的速度。芝加哥的贸易展览会已经强调了其作为北美食品和饮料加工业供应商的中央工业平台的重要性。第一个事件。 ProFood Tech的贸易展览会格式由Koelnmesse GmbH,PMMl:包装与加工技术协会和国际乳制品协会(IDFA)以及业界共同采用,并遵循领先的科隆贸易展览会的模式。该活动满足了业界多年来呼吁在美国建立一个单一,集中且强大的贸易平台的要求。每两年一次,它收集美洲大陆所有行业领域食品加工部门的供求情况。下一届ProFood Tech将于2019年3月26日至28日在芝加哥的Mccormick Place展览中心举行。为了与NAFTA市场的需求完全吻合,正在与业界进行对话以进一步制定计划。高质量的参展商咨询委员会,包括利乐,GEA,Harpak-ULMA包装,Serac等大型市场参与者,将参展商的利益捆绑在一起,并在展览会的概念化中代表了这些利益。

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