Features of the Influence of Thermal Action on Structural Changes in Copper Conductors

I. S. Konchakova; A. G. Kolmakov; A. E. Gvozdev

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Features of the Influence of Thermal Action on Structural Changes in Copper Conductors

机译：热动作对铜导线结构变化影响的特点

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The influence of annealing in the temperature range of 300–1000°C and exposure for 1–3 h on the structure of conductor PUNP 2x2.5 made of copper of M0 brand has been studied. The efficiency of the power-law and exponential models for predicting the average grain size during annealing of copper conductors has been examined.

机译：研究了退火在300-1000°C的温度范围内的影响和1-3小时对M0品牌铜的铜结构的1-3小时。研究了用于预测铜导体退火期间的用于预测平均晶粒尺寸的功率法和指数模型的效率。

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来源
《Inorganic materials: applied research》 |2021年第4期|993-999|共7页
作者
I. S. Konchakova; A. G. Kolmakov; A. E. Gvozdev;
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作者单位

Tula State Pedagogical University;

Baikov Institute of Metallurgy and Materials Science (IMET) Russian Academy of Sciences;

Tula State Pedagogical University;

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原文格式 PDF
正文语种 eng
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关键词
copper; conductors; recrystallization; annealing; grain size; mathematical model;

机译：铜;导体;重结晶;退火;晶粒尺寸;数学模型;

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Features of the Influence of Thermal Action on Structural Changes in Copper Conductors

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