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Optimization of via distribution and stacked via in multi-layered P/G networks

机译：在多层P / G网络中优化通孔分布和堆叠通孔

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摘要

The usage of via stack was not carefully studied in previous multi-layered P/G (Power/Ground) network designs. However, with feature size scaling down, the resistance of via is increasing quickly and their influence on voltage drop of P/G networks has become obvious. In this paper, two optimization techniques for via placement are proposed, which are proved to be helpful in reducing on die voltage drop. Firstly, an efficient heuristic algorithm based on sensitivity analysis is presented to optimize via distribution in early design stage. Compared with even distribution design strategies, averagely the heuristic algorithm can reduce the worst voltage drop by 8.43% without adding more vias. Secondly, experiments demonstrated that using stacked vias in nonadjacent layers is powerful in eliminating "hot" areas which suffer from large voltage drop. Based on this observation, a heuristic algorithm is developed to further reduce the worst voltage drop. Experiments show that voltage drop distribution can be well optimized by combining these two strategies together.
机译：在以前的多层P / G（电源/接地）网络设计中，没有仔细研究过通孔堆栈的用法。然而，随着特征尺寸的缩小，通孔的电阻迅速增加，并且它们对P / G网络的电压降的影响变得明显。本文提出了两种通孔布局的优化技术，它们被证明有助于减少管芯上的压降。首先，提出了一种基于敏感性分析的高效启发式算法，以在设计的早期阶段通过分配进行优化。与平均分配设计策略相比，启发式算法平均可以在不增加通孔的情况下将最差的压降降低8.43％。其次，实验表明，在不相邻的层中使用堆叠的过孔可以有效消除遭受大压降的“热”区域。基于此观察结果，开发了一种启发式算法来进一步减少最差的电压降。实验表明，将这两种策略结合在一起可以很好地优化电压降分布。

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  • 来源
    《Integration》 |2010年第3期|p.318-325|共8页
  • 作者

    Yici Cai; Jin Shi; Shuai Li;

  • 作者单位

    EDA Lab, Department of Computer Science and Technology, Tsinghua University, China;

    EDA Lab, Department of Computer Science and Technology, Tsinghua University, China;

    EDA Lab, Department of Computer Science and Technology, Tsinghua University, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    P/G network; voltage drop; via distribution; stacked via;

    机译：宝洁网络;电压下降;通过分配;通过堆叠;

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