THERMAL-HYDRAULIC PERFORMANCE OF A CNT BASED PIN FIN HEAT SINK FOR ELECTRONICS COOLING

M.F. ISMAIL; M.A. I. RASHID; M. MAHBUB

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THERMAL-HYDRAULIC PERFORMANCE OF A CNT BASED PIN FIN HEAT SINK FOR ELECTRONICS COOLING

机译：电子冷却的碳纳米管针脚散热片的热工液压性能

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This paper describes 3D numerical simulation of the fluid flow and heat transfer characteristics in a pin fin heat sink under constant heat flux condition. Carbon nanotube (CNT) is considered as an ideal material for thermal management in electronic packaging because of its extraordinarily high thermal conductivity. Fabricated onto a silicon substrate to form micro-channels, the CNT based cooling fins show high heat dissipation efficiency. The simulation is performed for the Reynolds number from 7 to 60 with channel hydraulic diameter 1.22 mm. The results are used to derive the Nusselt number, pressure drop, thermal resistance etc.

机译：本文描述了在恒定热通量条件下针翅式散热器中流体流动和传热特性的3D数值模拟。碳纳米管（CNT）由于具有极高的导热性，因此被认为是电子封装中进行热管理的理想材料。基于CNT的散热片被制造在硅基板上以形成微通道，显示出很高的散热效率。对通道液压直径为1.22 mm的雷诺数从7到60进行仿真。结果用于导出努塞尔数，压降，热阻等。

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来源
《Applied Mechanics and Engineering》 |2012年第4期|1149-1162|共14页
作者
M.F. ISMAIL; M.A. I. RASHID; M. MAHBUB;
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作者单位

Department of Mechanical Engineering Bangladesh University of Engineering and Technology BANGLADESH;

Department of Mechanical Engineering Bangladesh University of Engineering and Technology BANGLADESH;

Department of Mechanical Engineering Bangladesh University of Engineering and Technology BANGLADESH;

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原文格式 PDF
正文语种 eng
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关键词
thermal management; CNT; pin fin; thermal conductivity; heat dissipation efficiency;

机译：热管理;碳纳米管;针鳍导热系数;散热效率;

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专利

1. THERMAL-HYDRAULIC PERFORMANCE OF A CNT BASED PIN FIN HEAT SINK FOR ELECTRONICS COOLING [J] . M. F. ISMAIL, M. A. I. RASHID, M. MAHBUB International Journal of Applied Mechanics and Engineering . 2012,第4期

机译：电子冷却的碳纳米管针脚散热片的热工液压性能
2. Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling [J] . Yongtong Li, Liang Gong, Minghai Xu, Journal of Electronic Packaging . 2021,第1期

机译：金属泡沫散热器的热性能，具有用于非均匀热通量电子冷却的销翅片
3. Heat Transfer and Pressure Loss Characteristics of Very Compact Heat Sinks; Heat exchangers; orced convection; heat transfer; heat sinks, plate fins; pin fins; cross-flow cooling; jet cooling, thermal conductance, pressure loss [J] . asahito Tasaka, Toshio Aihara, Chihiro Hayashi Heat Transfer Asian Research . 1999,第8期

机译：非常紧凑的散热器的传热和压力损失特性；热交换器；强制对流传播热量;散热器，散热片；脚鳍；横流冷却；射流冷却，导热，压力损失
4. Influence of airflow bypass on the thermal performance and pressure drop of plate fin and pin fin heat sinks for electronics cooling [C] . H. Jonsson, B. Palm Eurotherm seminar on thermal management of electronic systems . 1998

机译：气流旁路对电子冷却钢板翅片和销翅片散热器热性能和压降的影响
5. Performance Evaluation of Plate-fin and Pin-fin Heat Sinks for The Application of Oil Immersion Cooling and Design Optimization of Dynamic Cold Plate for The Application of Warm Water cooling. [D] . Soni, Parth. 2016

机译：用于油浸冷却的板翅式和针翅式散热器的性能评估以及用于温水冷却的动态冷板的设计优化。
6. Hydraulic and Thermal Performance of Microchannel Heat Sink Inserted with Pin Fins [O] . Guo-Fu Xie, Lei Zhao, Yuan-Yuan Dong, 2021

机译：微通道散热器的液压和热性能插入销翅片
7. Performance of Shrouded Pin-Fin Heat Sinks for Electronic Cooling [O] . 2015

机译：用于电子冷却的带罩翅片散热器的性能

THERMAL-HYDRAULIC PERFORMANCE OF A CNT BASED PIN FIN HEAT SINK FOR ELECTRONICS COOLING

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