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首页> 外文期刊>International Journal of Heat and Mass Transfer >Experimental study on thermal performance of SMD-LED chips under the effects of electric wire pattern and LED arrangement
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Experimental study on thermal performance of SMD-LED chips under the effects of electric wire pattern and LED arrangement

机译：电线图案和LED排列对SMD-LED芯片热性能影响的实验研究

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摘要

This paper presents an experimental study on the thermal performance of SMD-LEDs (Surface Mount Device-Light Emitting Diodes) mounted on plate-fin heat sink (HS) and effects of LED arrangement, HS size, particularly heat spreading effect by electric wire pattern in PCB. Various types of LED arrays and HS sizes were investigated for both wide and narrow electric wires. By calibrating the temperature from IR thermometry, novel correlations were proposed for estimating the temperature of various surface types where the emissivity is not known. Thermal coupling effects between LEDs are analyzed and explained comprehensively. Experimental results indicate that electric wire patterned PCB causes not only LED temperature but also affects the temperature difference between LEDs, and non-uniform temperature distribution. The maximum temperature deviation between wide and narrow wire patterns is approximate 26.3 degrees C for 2 x 2 LEDs. Novel correlations between maximum junction temperature and LED power density are proposed. The results obtained implicate that the electric wire pattern along with LED arrangement and HS size needs to be designed carefully in thermal management of SMD-LED packages. (C) 2018 Elsevier Ltd. All rights reserved.
机译：本文对安装在板翅式散热器（HS）上的SMD-LED（表面贴装器件-发光二极管）的热性能以及LED布置，HS尺寸的影响，特别是电线图案的散热效果进行了实验研究。在PCB中。针对宽电线和窄电线，研究了各种类型的LED阵列和HS尺寸。通过用红外测温仪校准温度，提出了新颖的相关性，用于估算发射率未知的各种表面类型的温度。全面分析和解释了LED之间的热耦合效应。实验结果表明，用电线构图的PCB不仅会导致LED温度升高，还会影响LED之间的温差以及温度分布不均。对于2 x 2 LED，宽线和窄线之间的最大温度偏差约为26.3摄氏度。提出了最大结温和LED功率密度之间的新型关联。获得的结果表明，在SMD-LED封装的热管理中，电线图案以及LED排列和HS尺寸需要仔细设计。 （C）2018 Elsevier Ltd.保留所有权利。

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