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A study on the measurement and prediction of LED junction temperature

机译：LED结温的测量与预测研究

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In this study, an innovative method for the measurement of the LED junction temperature is proposed. In the proposed technique, the temperature values at the LED chip surface, at the solder joint, and at a substrate point in the vicinity of the LED are measured, and the results are compared with the junction temperature measured by transient thermal measurements method. The aforementioned three temperature values are precisely measured via an IR thermometry and thin wire thermocouple. For the demonstration of the feasibility of the IR thermometry to the LED chip surface, the spectral distribution of the LED emission is analyzed using a spectroradiometer. The results show that there is negligible IR irradiation at the LED, suggesting no IR-induced interference is expected for the surface temperature estimation. In order to validate the experimentally obtained temperature distribution, an FEM-based numerical study is also performed. The experimental and numerical results are shown to agree well to each other within 15%. Based on the results, an empirical equations that correlate the junction temperature and the temperature at the solder joint, substrate, and surface of LED are developed. In addition, we show that analyzation of the structure function containing thermal resistance data of LED package obtained from the transient thermal measurement can yield a good interpretation in regard to the thermal resistance of the LED itself. The proposed methodology can act as a good guideline for the thermal management of the LED-related products.
机译：在这项研究中，提出了一种创新的方法来测量LED结温。在提出的技术中，测量LED芯片表面，焊点处以及LED附近的基板点处的温度值，并将结果与​​通过瞬态热测量方法测得的结温进行比较。通过红外测温仪和细线热电偶可以精确测量上述三个温度值。为了证明对LED芯片表面进行红外测温的可行性，使用分光辐射计分析了LED发射的光谱分布。结果表明，LED的红外辐射微不足道，表明表面温度估计不会有红外辐射引起的干扰。为了验证实验获得的温度分布，还进行了基于FEM的数值研究。实验结果和数值结果显示在15％之内彼此吻合得很好。基于这些结果，建立了一个将结点温度与LED的焊点，基板和表面温度相关的经验方程。此外，我们表明，对包含通过瞬态热测量获得的LED封装的热阻数据的结构函数进行分析，可以对LED本身的热阻产生很好的解释。所提出的方法可以作为与LED相关的产品的热管理的良好指南。

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