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Coating solidification mechanism during plasma-sprayed filling the laser textured grooves

机译:等离子喷涂填充激光纹理凹槽时的涂层凝固机理

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The AISI 304 L stainless steel substrate was treated by laser surface texture to obtain texture groove widths and depths of 60 and 50 mu m, respectively. Molybdenum coating was deposited on the substrate by atmospheric plasma spraying. 3D surface topography instrument was used to extract the groove profile, and MATLAB was utilized to fit the quadratic parabola to develop a texture groove model. A commercial software-based volume of fluid method is developed to 3D simulate the single groove multi-droplet filling. The simulation parameters were determined experimentally, in which the droplet diameter, impact velocity, initial droplet, and substrate temperature were 50 mu m, 60 m/s, 2800 degrees C, and 25 degrees C, respectively. The solidification mechanism of the filling coating in the substrate groove was investigated. The cross-sectional morphology and element distribution of the filled coating were characterized by scanning electron microscopy and energy dispersive spectroscopy, respectively. The bonding state and filling quality of the grooved substrate and filling coating were studied. Results showed that the first splat is filled effectively in the texture groove and solidified to form an evident groove shape. The air entrained by the filling coating is mainly distributed in the interfacial and interlamination gap, and its content is high when it is close to the edge. The filling coating and substrate in the groove are a combination of mechanical and metallurgical bonding. (C) 2019 Elsevier Ltd. All rights reserved.
机译:AISI 304 L不锈钢基板经过激光表面纹理处理,分别获得60和50μm的纹理凹槽宽度和深度。通过大气等离子喷涂将钼涂层沉积在基底上。使用3D表面地形仪提取凹槽轮廓,并使用MATLAB拟合二次抛物线以开发纹理凹槽模型。开发了一种基于商业软件的流体体积方法,以3D模拟单槽多液滴填充。通过实验确定模拟参数,其中液滴直径,冲击速度,初始液滴和基板温度分别为50μm,60 m / s,2800摄氏度和25摄氏度。研究了基体凹槽中填充涂层的凝固机理。通过扫描电子显微镜和能量色散谱分别表征了填充涂层的横截面形态和元素分布。研究了带槽基材与填充涂层的结合状态和填充质量。结果表明,第一个splat有效地填充在纹理凹槽中并固化形成明显的凹槽形状。填充涂层夹带的空气主要分布在界面间隙和层间间隙中,靠近边缘时其含量较高。凹槽中的填充涂层和基材是机械结合和冶金结合的组合。 (C)2019 Elsevier Ltd.保留所有权利。

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