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首页> 外文期刊>International Journal of Heat and Mass Transfer >A 3D numerical study of a molten solder droplet's wetting and solidifying on a pillar with application to electronic packaging
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A 3D numerical study of a molten solder droplet's wetting and solidifying on a pillar with application to electronic packaging

机译：熔融焊料液滴润湿和柱子凝固的3D数值研究，用应用于电子包装

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摘要

The 3D problem of spreading and solidification of a molten solder droplet (with a melting temperature of T_m and a radius of R_d) on a circular pillar (with a radius R_(pillar) and a height H_(pillar), having a contact angle θ_(pillar) at wall temperature T_(pillar)) above a substrate has important applications in electronic packaging. In this paper, effects of pillar's contact angle and wall temperature on droplet dynamics and solidification of the solder droplet are studied numerically based on a newly developed 3D multi-component, triple-phase-change LB model. For pillar's wall temperature equal to the melting temperature of the molten droplet (T_(pillar) = T_m), no solidification takes place in the droplet after its contact with the pillar, and droplet's spreading characteristics depend on the pillar's contact angle. If pillar's contact angle (θ_(pillar)) is smaller than a critical contact angle (θ_(pillar))_(cr), i.e., θ_(pillar) ＜ (θ_(pillar))_(cr), the solder droplet spreads toward the edge of the pillar's top, turning around the corner of the pillar and spreading downward along the pillar's side wall. Based on LB simulated results, a map in terms of (θ_(pillar)) versus (R_d/R_(pillar)) is presented, showing regimes of droplet spreading and not spreading around the corner of the pillar. An analytical expression for predicting the critical contact angle of the pillar is derived, which is shown to divide these two regimes in the map. LB simulations are also carried out for the case when pillar's wall temperature is lower than the melting temperature of the molten droplet (i.e., T_(pillar) ＜ T_m). Under this situation, it is shown that although no solidification takes place during the initial spreading motion, but solder bumps begin to be formed subsequently due to solidification and droplet's spreading motion is arrested as a result. Since formation of solder bumps on pillar's side wall may lead to short circuit of electric connection between solder bumps with other electric sources in the gap between the pillars, it is important to prevent the formation of solder bumps on pillar's side wall. For this purpose, a map of (θ_(pillar)) versus (R_d/R_(pillar)) at different Stefan numbers (denoting the effect of pillar's wall temperature T_(pillar)) is obtained to define the regime in which no solder bumps are formed on the pillar's side wall.
机译：熔融焊料液滴的三维问题和凝固熔融焊料液滴（T_M的熔化温度和R_D的半径）（具有半径R_（柱）和高度H_（柱），具有接触角θ_ （支柱）在衬底上方的壁温T_（支柱））在电子包装中具有重要的应用。在本文中，基于新开发的3D多分量，三相变化LB模型，研究了支柱的接触角和壁温对液滴动力学和焊料液滴凝固的影响。对于柱的壁温等于熔融液滴的熔化温度（T_（支柱）= T_M），在与柱接触后的液滴中没有凝固，并且液滴的展开特性取决于柱的接触角。如果柱的接触角（θ_（柱））小于临界接触角（θ_（柱））_（CR），即θ_（柱）<（θ_（竖柱））_（CR），焊料液滴扩散朝着支柱顶部的边缘，转动支柱的角落并沿着支柱的侧壁向下展开。基于LB模拟结果，提出了（θ_（柱））与（R_D / R_（柱））的地图，示出了液滴扩散的制度而不是在柱的角落散布。推导出用于预测柱的临界接触角的分析表达，其显示在地图中划分这两个制度。当柱的壁温度低于熔融液滴的熔化温度时，也对这种情况进行了LB仿真（即，T_（柱）

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  • 来源
    《International Journal of Heat and Mass Transfer》 |2020年第6期|119585.1-119585.14|共14页
  • 作者

    Wei Xiong; Ping Cheng;

  • 作者单位

    MOE Key Laboratory for Power Machinery and Engineering School of Mechanical Engineering Shanghai Jiao Tong University Shanghai 200240 PR China;

    MOE Key Laboratory for Power Machinery and Engineering School of Mechanical Engineering Shanghai Jiao Tong University Shanghai 200240 PR China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Wetting; Solidifying; Molten droplet; Pillar; Lattice Boltzmann method (LBM);

    机译：润湿;凝;熔融液滴;支柱;格子Boltzmann方法（LBM）;

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