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Transient heat transfer of impinging jets on superheated wetting and non-wetting surfaces

机译：过热润湿和非润湿表面撞击喷射的瞬态传热

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摘要

Superhydrophobic (SH) surfaces possess desirable anti-fouling properties due to low wettability, but have also been shown to reduce heat transfer to subcooled water in impinging jet scenarios. In this work, superheated silicon substrates with varying wettability (hydrophilic or HPi, hydrophobic or HPo, SH) are quenched by an impinging water jet, where the substrate temperature is above the saturation temperature. Silicon wafers are either oxidized to create HPi surfaces, coated with Teflon to make the surface HPo, or plasma-etched and coated to create the necessary micro-texture for SH conditions. All wafers are integrated with an electric resistance heater and then heated to temperatures of 200-320 C before impingement with an axisymmetric room temperature water jet of varying specified flow rates yielding jet Reynolds numbers between 6000 and 18,000. High-speed visual data is collected, showing how the lamellar liquid contact region, limited by thermal breakup due to boiling, grows radially as the surface cools to temperatures below saturation. This data is correlated to temperature data recorded on the back side of the wafer using a thermal camera. Results of this study confirm previous conjecture that surface wettability can alter maximum heat flux, which is quantified here for the described scenario by up to 40%, and can also affect jet thin film spreading by up to 50%. Increasing initial surface temperature decreases thin film spreading rate on all surfaces, and increases heat transfer on all but the SH surfaces. Increasing Reynolds number yields an increase in heat flux, and affects both the thin film spreading rate as well as the maximum radius of the thin film region.
机译：超疏水（SH）表面由于低润湿性而具有所需的防污性能，但也已被证明在撞击喷射场景中将热传递降低到过冷水中。在该工作中，通过撞击水射流淬灭具有不同润湿性（亲水或HPI，疏水或HPO，SH）的过热的硅基衬底，其中基板温度高于饱和温度。硅晶片被氧化以产生HPI表面，涂有Teflon以制备表面HPO，或等离子体蚀刻并涂覆以产生SH条件的必要微观纹理。所有晶片都与电阻加热器集成，然后在冲击之前加热到200-320℃的温度，该轴对称室温水射流改变特定流速，产生射流雷诺数在6000和18,000之间。收集高速视觉数据，示出了由于表面冷却至低于饱和度的温度，所示，通过沸腾引起的热分裂受限的气体接触区域的限制。该数据与使用热相机相关的与记录在晶片背面的温度数据。该研究的结果证实了先前的猜想，即表面润湿性可以改变最大热量通量，这对于所描述的场景量高达40％，并且还可以影响射流薄膜蔓延至50％。增加初始表面温度降低了所有表面上的薄膜扩散速率，并增加了除SH表面之外的所有传热。增加雷诺数产生热通量的增加，并影响薄膜扩散率以及薄膜区域的最大半径。

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  • 来源
    《International Journal of Heat and Mass Transfer》 |2021年第8期|121056.1-121056.12|共12页
  • 作者

    D. Jacob Butterfield; Brian D. Iverson; Daniel Maynes; Julie Crockett;

  • 作者单位

    Department of Mechanical Engineering Brigham Young University 350 Engineering Building Provo UT 84602 USA;

    Department of Mechanical Engineering Brigham Young University 350 Engineering Building Provo UT 84602 USA;

    Department of Mechanical Engineering Brigham Young University 350 Engineering Building Provo UT 84602 USA;

    Department of Mechanical Engineering Brigham Young University 350 Engineering Building Provo UT 84602 USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Superhydrophobic; Jet impingement; Boiling heat transfer;

    机译：超富氢化;喷射冲击;沸腾热传递;

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