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首页> 外文期刊>International Journal of Heat and Mass Transfer >Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits
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Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits

机译：微针翅片散热器的热设计和管理，用于节能三维堆叠集成电路

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摘要

Three-dimensional stacked electronics have substantially improved the electrical performance of integrated circuits. However, given the geometrical complexity and high pressure drop they entail, thermal management difficulties and energy requirements are exacerbated owing to the inapplicability of thermal management schemes. In this study, the thermal and hydrodynamic characteristics of various micro-pin fin arrays were investigated to maximize heat dissipation while minimizing the energy consumption. Specifically, a 10 × 10 mm~2 micro-pin fin array was fabricated on an eight-inch silicon wafer via mi-crofabrication. A Pyrex cover was bonded anodically with the top side of the micro-pin fins to prevent leakage, and a titanium/gold thin film serpentine heater was used to supply uniform heat flux on the backside of the micro-pin fin array. Subsequently, the heat transfer and pressure drop in the micro-pin fin heat sinks were obtained experimentally with various micro-pin fin geometries having pin diameter D_f = 38-100 μm, transverse pin spacing Si = 74-301 μm, longitudinal pin spacing S_L = 74-301 μm and pin height H_f = 90-207 μm. Thereafter, the geometrical and operational effects on heat transfer and pressure drop were investigated based on a consolidated database cumulated from the literature. Altogether, 256 data points from 21 geometrical combinations were explored from existing relevant studies to obtain optimized geometric and operating conditions in the micro-pin fin arrays over a wide range of geometri-cal and operating conditions: Reynolds number Re = 35-491.3, heat flux q" = 0-114 W/cm~2, pin diameter D_f = 38-559 μm, pin spacing S = 74-800 μm, and pin height H_f = 90-845 μm. Subsequently, new empirical correlations based on the consolidated database were formulated to describe the Nusselt number and fanning friction factor in the micro-pin fin arrays. These correlations provide suitable predictions in comparison with those based on extant correlations.
机译：三维堆叠电子基本上提高了集成电路的电气性能。然而，由于热管理方案的不适用，鉴于几何复杂性和高压下降，因此热管理困难和能量要求加剧了。在该研究中，研究了各种微销翅片阵列的热和流体动力学特性，以最大限度地提高散热，同时最小化能量消耗。具体地，通过Mi-Crofabrication在八英寸硅晶片上制造10×10mm〜2微引脚翅片阵列。通过微销鳍片的顶侧阳极粘合粘合覆盖，以防止泄漏，并且使用钛/金薄膜蛇形加热器在微引脚翅片阵列的背面供应均匀的热通量。随后，通过具有引脚直径D_F =38-100μm，横向销间距Si =74-301μm，纵向销间距S_L的各种微引脚翅片散热器中的传热和压降。 =74-301μm和引脚高度H_F =90-207μm。此后，基于从文献中累积的综合数据库研究了对传热和压降的几何和操作效应。完全，从现有相关研究探索了256个从21个几何组合的数据点，以获得微引脚翅片阵列中的优化几何和操作条件，在各种各样的地质物和操作条件下：Reynolds Number Re = 35-491.3，热量磁通Q“= 0-114 W / cm〜2，引脚直径D_F =38-559μm，引脚间距S =74-800μm，销高度H_F =90-845μm。随后，基于综合的新的经验相关性制定数据库以描述微引脚翅片阵列中的营养号码和扇形摩擦系数。这些相关性与基于远端相关性的那些相比提供了合适的预测。

著录项

  • 来源
    《International Journal of Heat and Mass Transfer》 |2021年第8期|121192.1-121192.14|共14页
  • 作者

    Daewoong Jung; Haeun Lee; Daeyoung Kong; Eunho Cho; Ki Wook Jung; Chirag R. Kharangate; Madhusudan Iyengar; Chris Malone; Mehdi Asheghi; Kenneth E. Goodson; Hyoungsoon Lee;

  • 作者单位

    School of Mechanical Engineering Chung-Ang University Seoul 06974 Republic of Korea;

    School of Mechanical Engineering Chung-Ang University Seoul 06974 Republic of Korea Department of Intelligent Energy and Industry Chung-Ang University Seoul 06974 Republic of Korea;

    School of Mechanical Engineering Chung-Ang University Seoul 06974 Republic of Korea Department of Intelligent Energy and Industry Chung-Ang University Seoul 06974 Republic of Korea;

    School of Mechanical Engineering Chung-Ang University Seoul 06974 Republic of Korea;

    Department of Mechanical Engineering Stanford University Stanford CA 94305 USA;

    Mechanical and Aerospace Engineering Department Case Western Reserve University Cleveland OH 44106 USA;

    Google LLC Mountain View CA 94043 USA;

    Google LLC Mountain View CA 94043 USA;

    Department of Mechanical Engineering Stanford University Stanford CA 94305 USA;

    Department of Mechanical Engineering Stanford University Stanford CA 94305 USA;

    School of Mechanical Engineering Chung-Ang University Seoul 06974 Republic of Korea Department of Intelligent Energy and Industry Chung-Ang University Seoul 06974 Republic of Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    3D integrated circuit; thermal management; micro-pin fin array; heat transfer; pressure drop; thermal performance index;

    机译：3D集成电路;热管理;微引脚翅片阵列;传播热量;压力下降;热性能指标;

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