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首页> 外文期刊>International Journal of Heat and Mass Transfer >Numerical simulation of the solidification phenomena of single molten droplets impinging on non-isothermal flat plate using explicit moving particle simulation method
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Numerical simulation of the solidification phenomena of single molten droplets impinging on non-isothermal flat plate using explicit moving particle simulation method

机译：用明确的运动粒子模拟方法在非等温平板上撞击非等温扁平板的单熔滴凝固现象的数值模拟

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摘要

In jet engines and gas turbines, the deposition phenomenon is attributed to the adhesion of molten droplets on walls. In this study, numerical simulations of the deposition phenomena on a substrate were performed using the explicit moving particle simulation (E-MPS) method. We adopted a non-isothermal condition for the substrate using a coupling method including wall particles and a regular grid to estimate the heat conduction to and within the substrate for enhanced numerical accuracy. This coupling method was validated by comparing the theoretical values of the one-dimensional unsteady heat conduction. Simulations were performed to study the solidification phenomena of a single molten stannum (Sn) droplet impinging and solidifying on a vertical substrate. The droplet behavior from impingement to solidification shows reasonable agreement with experimental results in terms of spread factor, taking into account the heat exchange between the droplet and substrate, including the substrate temperature change. Although temperature change in the substrate is limited to areas near the impinging droplet, temperature distributions on the interface differ between the early and later stages. The high-temperature region appears near the impinging center except near the stagnation point for the former stage, while it is near the center for the latter stage. The finger and bump shapes around the impinging droplet are explained via Rayleigh-Taylor and Plateau-Rayleigh instabilities, respectively, using the actual expanding acceleration of the liquid film.
机译：在喷射发动机和燃气轮机中，沉积现象归因于熔融液滴在壁上的粘附性。在该研究中，使用显式移动粒子仿真（E-MPS）方法进行衬底上的沉积现象的数值模拟。我们使用包括壁颗粒和规则网格的耦合方法对基板采用了非等温条件，以估计基板内和基板内的热传导以提高数值精度。通过比较一维不稳定热传导的理论值来验证该耦合方法。进行模拟以研究撞击并凝固在垂直基底上的单个熔融甾体（Sn）液滴的凝固现象。考虑到液滴和基材之间的热交换，包括基板温度变化，从凝固到凝固的液滴行为与实验结果表明了与展开因子之间的实验结果一致。尽管基板中的温度变化限于撞击液滴附近的区域，但界面上的温度分布在早期和以后的阶段之间的不同。除了前阶段的停滞点附近，高温区域出现在撞击中心附近，而在后期阶段的中心附近。通过瑞利 - 泰勒和高原瑞利稳定性解释撞击液滴周围的手指和凸块形状，使用液膜的实际扩张加速度来解释。

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