Semi-analytic approximation of the temperature field resulting from moving heat loads

著录项

• 来源
  《International Journal of Heat and Mass Transfer》 |2018年第7期|128-137|共10页
• 作者

  D.W.M. Veldman; R.H.B. Fey; H.J. Zwart; M.M.J. van de Wal; J.D.B.J. van den Boom; H. Nijmeijer;

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• 作者单位

  Department of Mechanical Engineering, Eindhoven University of Technology;

  Department of Mechanical Engineering, Eindhoven University of Technology;

  Department of Mechanical Engineering, Eindhoven University of Technology,Department of Applied Mathematics, University of Twente;

  ASML;

  ASML;

  Department of Mechanical Engineering, Eindhoven University of Technology;

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• 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词

  Moving heat source; Finite elements; Wafer heating;

  机译：移动热源;有限元;晶片加热;