Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system

Illés Balázs; Skwarek Agata; Géczy Attila; Krammer Olivér; Bušek David

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Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system

机译：真空气相焊接系统中传热和传质过程的数值模型

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摘要

The heat and mass transport processes were investigated with numerical simulations in a vacuum vapour phase soldering system during the vapour suctioning process. Low vapour pressure/concentration is applied during vacuum soldering to decrease the number of gas voids in the solder joints. Three-dimensional numerical flow model was developed which based on the Reynolds averaged Navier-Stokes equations with the standard k-ε turbulence method. The decrease of the vapour concentration and its effects on the solder joints were studied in the case of different oven settings. It was found that vapour suctioning has considerable effects on the heat transfer processes in the soldering chamber which might lead to early solidification of the solder joints and reduces the efficiency of the void removal. Different oven settings were simulated in order to decrease the heat loss of the soldering chamber during the vapour suctioning. It was shown that with appropriate setting of the vacuum vapour phase soldering technology, the efficiency of the void removal can be increased.

机译：在真空抽吸过程中，在真空气相焊接系统中通过数值模拟研究了热量和质量的传输过程。在真空焊接过程中施加低蒸气压/浓度以减少焊点中的气孔数量。建立了三维数值流模型，该模型基于雷诺兹平均Navier-Stokes方程，采用标准k-ε湍流方法。在不同的烤箱设置下，研究了蒸汽浓度的降低及其对焊点的影响。已经发现，蒸气抽吸对焊接室内的传热过程具有相当大的影响，这可能导致焊料接头的早期固化并且降低了空隙去除的效率。模拟了不同的烤箱设置，以减少蒸汽抽吸过程中焊接室的热损失。结果表明，通过适当设置真空气相焊接技术，可以提高去除空隙的效率。

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来源
《International Journal of Heat and Mass Transfer》 |2017年第11期|613-620|共8页
作者
Illés Balázs; Skwarek Agata; Géczy Attila; Krammer Olivér; Bušek David;
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作者单位

Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary,Department of Electrotechnology, Czech Technical University in Prague, Czech Republic;

Department of Microelectronics, Institute of Electron Technology, Krakow, Poland;

Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary,Department of Electrotechnology, Czech Technical University in Prague, Czech Republic;

Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary,Department of Electrotechnology, Czech Technical University in Prague, Czech Republic;

Department of Electrotechnology, Czech Technical University in Prague, Czech Republic;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类
关键词
Gas void; RANS; Standard k-ε turbulence method; Vacuum vapour phase soldering; Vapour concentration;

机译：气孔;RANS;标准k-ε湍流法;真空气相焊接;蒸气浓度;

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Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system

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