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首页> 外文期刊>International Journal of Heat and Mass Transfer >Conjugate natural convection inside a vertical enclosure with solid obstacles of unique volume and multiple morphologies
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Conjugate natural convection inside a vertical enclosure with solid obstacles of unique volume and multiple morphologies

机译：在垂直外壳内共轭自然对流，具有独特体积和多种形态的固体障碍物

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摘要

Effect of the solid obstacles on the natural laminar convection in a vertical enclosure is numerically and analytically investigated in the present work, aiming to identify suitable arrangements for heat transfer enhancement in the electronic cooling units. Two categories of morphology were taken into considerations, being attached to the horizontal walls and being placed centrally in the space. Thermal Rayleigh number, number of obstacles, and solid thermal conductivity have been varied to observe inherent flow structures and thermal transport mechanism, regarding of different levels of solid-to-fluid volume ratios. Flow field, thermal field and heat transfer rates are respectively visualized through streamlines, isotherms and heatlines. Depending on a large set of numerical data and critical boundary layer analysis, correlations have been developed for these two fundamental configurations. Results demonstrate that average Nusselt number is an increasing function of Ra and Kr and a decreasing function of γ and N_a (and N_B). Furthermore, average Nusselt number of enclosure B is greater than that of enclosure A when volume ratio is lower, while this phenomenon is contrary as the volume ratio and relative obstacles number increases. These two configurations of obstacles number are important to optimize the cooling efficient of electronic components.
机译：在本工作中，对固体障碍物对垂直外壳中自然层流对流的影响进行了数值和分析研究，旨在确定电子冷却单元中增强传热的合适布置。考虑了两类形态，分别附着在水平墙上和居中放置在空间中。考虑到不同的固体与流体体积比水平，已经改变了热瑞利数，障碍物数目和固体导热率，以观察固有的流动结构和热传递机理。流场，热场和传热速率分别通过流线，等温线和热线可视化。根据大量的数值数据和临界边界层分析，已经针对这两种基本配置开发了相关性。结果表明，平均Nusselt数是Ra和Kr的增加函数，是γ和N_a（和N_B）的减少函数。此外，当体积比较低时，外壳B的平均Nusselt数大于外壳A的Nusselt数，而随着体积比和相对障碍物数量的增加，这种现象是相反的。障碍物数量的这两种配置对于优化电子组件的冷却效率非常重要。

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