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Contact measurement of thermal conductivity and thermal diffusivity of solid materials: Experimental validation of feasibility with a prototype sensor

机译:固体材料的热导率和热扩散率的接触测量:使用原型传感器进行可行性的实验验证

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摘要

A contact method has been proposed for measuring thermal transport properties of solids including soft materials. The method has an advantage of potential utilization for in-situ measurement without preparing a sample specimen. A unique feature of the method is to prepare a shallow cavity around a film sensor for a layer of a gel that is used to eliminate the thermal contact resistance between the sensor and the sample. A prototype sensor, 3 mm in diameter, was fabricated on the surface of 0.16-mm thick glass substrate, and used with a 50-μm thick silicon rubber sheet as a spacer for the gel. The transient temperature rise of the sensor was determined from the electrical resistance after heating the sensor at a constant current. The thermal conductivity and the thermal diffusivity of a sample as well as the thickness of the gel layer were then determined from an iteratively obtained theoretical temperature rise that agreed with the measured temperature rise. The results obtained by the experiments with four different materials indicated that the thermal conductivity could be determined within 10% errors. The present study therefore demonstrated feasibility of the method, while improvement is still needed to reduce the error particularly in the thermal diffusivity.
机译:已经提出了一种接触方法来测量包括软材料在内的固体的热传递性质。该方法的优点是无需准备样品就可以潜在地用于原位测量。该方法的独特功能是在薄膜传感器周围准备一个浅腔,用于一层凝胶,以消除传感器和样品之间的热接触电阻。在0.16毫米厚的玻璃基板表面上制造了直径3毫米的原型传感器,并将其与50微米厚的硅橡胶片一起用作凝胶的垫片。由传感器以恒定电流加热后的电阻确定传感器的瞬态温度升高。然后,从迭代获得的理论温升中确定样品的导热率和热扩散率以及凝胶层的厚度,该理论温升与测得的温升一致。通过使用四种不同材料的实验获得的结果表明,可以在10%的误差范围内确定导热系数。因此,本研究证明了该方法的可行性,同时仍需要改进以减少误差,尤其是在热扩散率方面。

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