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A fast non-intrusive method for estimating spatial thermal contact conductance by means of the reciprocity functional approach and the method of fundamental solutions

机译:通过互易函数法和基本解法快速估算空间热接触电导的非侵入式方法

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摘要

Thermal contact conductance is very important in many heat transfer applications, such as electronic packaging, nuclear reactors, aerospace and biomedicine, among others. The determination of the thermal contact resistance/conductance is a very difficult task. The objective of this paper is to present a methodology to estimate the spatial variation of this parameter without intrusive measurements. The methodology presented is formulated in terms of a reciprocity functional approach together with the method of fundamental solutions. The solution is composed of two steps. In the first step, two auxiliary problems, which do not depend on the thermal conductance variation, are solved. With the results of this pre-processing, different thermal conductances can be recovered by simply performing an integral. Thus, the methodology is extremely fast and can be used to detect flaws in different materials in a short time.
机译:热接触传导在许多传热应用中非常重要,例如电子包装,核反应堆,航空航天和生物医学等。热接触电阻/电导的确定是非常困难的任务。本文的目的是提出一种无需介入测量即可估算该参数空间变化的方法。所介绍的方法是根据互惠功能方法和基本解决方案一起制定的。该解决方案包括两个步骤。第一步,解决了两个不依赖于导热系数变化的辅助问题。利用该预处理的结果,可以通过简单地执行积分来恢复不同的热导。因此,该方法极其快速,可用于在短时间内检测不同材料中的缺陷。

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