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首页> 外文期刊>International Journal of Heat and Mass Transfer >Solidification of a ternary alloy liquid layer on a substrate subject to self-consistent melting
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Solidification of a ternary alloy liquid layer on a substrate subject to self-consistent melting

机译：三元合金液体层在基体上的凝固过程

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摘要

Micro-electro-mechanical (MEMS), plasma or powder spray deposition, surface coating, semiconductor technology, splat cooling, single and twin-roller melt-spinning, strip and slab casting, melt-extraction, etc. are usually characterized by solidification of a thin liquid layer on a cold substrate. A one-dimensional model of enthalpy formation of the energy and species conservation equations with ther-modynamic relationships from ternary equilibrium diagram are solved to study the solidification processes for ternary alloys molten liquid layer on the ternary eutectic solid substrate. The solidification path of the liquid layer may pass through the primary, cotectic and eutectic solidification regions. The melting and re-solidification of the substrate happens at the ternary eutectic point. The thermal physical properties of the splat and substrate are identical and imperfect contact of contact surface between the splat and substrate is considered. The temperature functions as compositions are assumed as linear along the liquidus surface and cotectic curves. The temperature distributions of the solidified splat and the melted, re-solidified substrate, the thicknesses of the different mushy layers of splat and melting of substrate subject to different process parameters and thermal physical properties are quantitatively and extensively investigated. The initiation times for primary, cotectic mushy and eutectic solid fronts of splat and the complete re-solidification times of the substrate are affected by different parameters, these are also investigated. Results of this study are compared with experimental data provided by Aitta et al. The growth rates of the cotectic and eutectic fronts are found to agree well with experimental data. The effects of initial solute concentrations of liquid layer, solute concentrations and temperatures at the binary and ternary eutectic points on the thicknesses of different mushy layers are important and presented.
机译：微机电（MEMS），等离子或粉末喷涂，表面涂层，半导体技术，平板冷却，单辊和双辊熔融纺丝，板坯和板坯铸造，熔体萃取等通常具有以下特征：冷基板上的薄液体层。根据三元平衡图，建立了具有热力学关系的一维能量和物种守恒方程的焓形成模型，以研究三元共晶固体基体上三元合金熔融液层的凝固过程。液体层的固化路径可以穿过主要的，共晶的和共晶的固化区域。基材的熔化和再固化在三元共晶点发生。短片和基底的热物理性质相同，并且认为短片和基底之间的接触表面接触不良。作为成分的温度函数假定为沿着液相线表面和共晶曲线呈线性。定量和广泛地研究了固化的短片和熔化，再固化的基材的温度分布，不同的短片糊状层的厚度以及基材在不同工艺参数和热物理性能的作用下的熔化情况。 splat的初级，共晶糊状和共晶固体前沿的起始时间以及底材的完全再固化时间受不同参数的影响，并进行了研究。这项研究的结果与Aitta等提供的实验数据进行了比较。发现共晶和共晶前沿的生长速率与实验数据吻合良好。重要和提出了液层的初始溶质浓度，二元和三元共晶点处的溶质浓度和温度对不同糊状层厚度的影响。

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