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首页> 外文期刊>International Journal of Heat and Mass Transfer >Three-dimensional analysis of heat transfer in a micro-heat sink with single phase flow
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Three-dimensional analysis of heat transfer in a micro-heat sink with single phase flow

机译：单相流微散热器中传热的三维分析

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A detailed numerical simulation of forced convection heat transfer occurring in silicon-based microchannel heat sinks has been conducted using a simplified three-dimensional conjugate heat transfer model (2D fluid flow and 3D heat transfer). The micro-heat sink model consists of a 10 mm long silicon substrate, with rectangular microchannels, 57 um wide and 180 μm deep, fabricated along the entire length. A finite difference numerical code with a Tri-Diagonal Matrix Algorithm (TDMA) was developed to solve the governing equations. The validated code provided detailed temperature and heat flux distributions in the microchannel heat sink. The influence of the geometric parameters of the channel and the thermophysical properties of the fluid on the flow and heat transfer, are investigated by evaluating thermophysical properties at a reference bulk temperature. The results indicate that thermophysical properties of the liquid can significantly influence both the flow and heat transfer in the microchannel heat sink. The bulk liquid temperature is shown to vary in a quasi-linear form along the flow direction for high fluid flow rates, but not for low flow rates. Comparison of the numerical results with other published numerical results and experimental data available in the literature for Reynolds numbers less than 200 based on a hydraulic diameter of D{sub}h = 86 μm and D{sub}h/L{sub}x < 0.01, indicates that the assumption of hydrodynamic, fully developed laminar flow is valid. The thermal entrance length is also obtained from the detailed local heat transfer coefficient calculation and a correlation for the overall averaged Nusselt number is developed and discussed. Finally, a methodology is proposed whereby measured data can be evaluated and processed in order to provide a more complete understanding and better interpretation of these experimental data.
机译：已使用简化的三维共轭传热模型（2D流体流动和3D传热）对基于硅的微通道散热器中发生的强制对流传热进行了详细的数值模拟。微型散热器模型由10毫米长的硅基板组成，该基板具有沿整个长度制造的矩形微通道，矩形微通道宽57 um，深180μm。开发了具有三对角矩阵算法（TDMA）的有限差分数字代码来求解控制方程。经验证的代码提供了微通道散热器中详细的温度和热通量分布。通过评估参考整体温度下的热物理性质，研究了通道的几何参数以及流体的热物理性质对流动和传热的影响。结果表明，液体的热物理性质可以显着影响微通道散热器中的流动和传热。对于大的流体流速，显示的总体液体温度沿着流动方向以准线性形式变化，但对于低的流体流速则没有。基于水力直径D {sub} h = 86μm和D {sub} h / L {sub} x <的水力直径，将数值结果与其他已发表的数值结果和文献中的小于200雷诺数的实验数据进行比较0.01，表明流体动力的，充分发展的层流假设是正确的。还可以通过详细的局部传热系数计算获得热入口长度，并开发和讨论总平均努塞尔数的相关性。最后，提出了一种方法，可以对测量的数据进行评估和处理，以提供对这些实验数据的更完整的理解和更好的解释。

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