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首页> 外文期刊>International Journal of Heat and Mass Transfer >THREE-DIMENSIONAL CONJUGATE HEAT TRANSFER IN THE MICROCHANNEL HEAT SINK FOR ELECTRONIC PACKAGING
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THREE-DIMENSIONAL CONJUGATE HEAT TRANSFER IN THE MICROCHANNEL HEAT SINK FOR ELECTRONIC PACKAGING

机译：电子包装微通道热沉中的三维共轭传热

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摘要

A three-dimensional model is developed to investigate flow and conjugate heat transfer in the microchannel-based heat sink for electronic packaging applications. The incompressible laminar Navier-Stokes equations of motion are employed as the governing conservation equations which are numerically solved using the generalized single-equation framework for solving conjugate problems. The theoretical model developed is validated by comparing the predictions of the thermal resistance and the friction coefficient with available experimental data for a wide range of Reynolds numbers. The detailed temperature and heat flux distributions as well as the average heat transfer characteristics are reported and discussed. The analysis provides a unique fundamental insight into the complex heat flow pattern established in the channel due to combined convection-conduction effects in the three-dimensional setting. Important practical recommendations are also provided regarding the cooling efficiency of the microchannel heat sinks as well as a possible failure due to the thermal stresses induced by the extremely large temperature gradient at the entrance of the channels.
机译：开发了一个三维模型来研究电子包装应用中基于微通道的散热器中的流动和共轭传热。使用不可压缩的层状Navier-Stokes运动方程作为控制守恒方程，使用广义单方程框架对共轭问题进行数值求解。通过将热阻和摩擦系数的预测值与适用于各种雷诺数的实验数据进行比较，可以验证所开发的理论模型的有效性。报告并讨论了详细的温度和热通量分布以及平均传热特性。由于在三维环境中对流传导的综合影响，该分析为通道中建立的复杂热流模式提供了独特的基本见解。还提供了重要的实用建议，涉及微通道散热器的冷却效率以及由于通道入口处非常大的温度梯度引起的热应力而可能导致的故障。

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