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首页> 外文期刊>International journal of infomation technology and management >Application of RFID on equipment parts readiness management system of semiconductor packaging plant
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Application of RFID on equipment parts readiness management system of semiconductor packaging plant

机译：RFID在半导体封装厂设备零件准备管理系统中的应用

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摘要

Management of equipment parts readiness Tor process setup adjustment to meet variable order requirements in a semiconductor packaging plant is crucial to the health of production lines and downtime avoidance. In order to improve the current equipment parts readiness management system, which is exercised by periodical manual verification, this paper propose a RFID-enabled equipment parts readiness management system (REPR-MS) to take advantage of RFID technology in real-time monitor and track the equipment parts readiness flow. To validate the design, four tests of hypotheses were developed to compare the before and after introducing RKPR-MS on four different parts flow impacted areas. The hypotheses were tested using survey data originated from a semiconductor packaging plant. This paper studies against the combined pilot run data based on the equipment parts readiness management operation proposed under REPR-MS. Moreover, this paper investigates the production time saving of individual station of the assembly line in the studied plant and the affected rate of average time of each operating step of equipment parts readiness management after introducing REPR-MS. The results show significant potential and promising efficiency for performance improvement and cost saving after adopting REPR-MS.
机译：设备零件就绪状态的管理调整Tor工艺设置以满足半导体封装厂中变化的订单要求，这对于生产线的健康和避免停机至关重要。为了改进当前的设备零件就绪管理系统（通过定期的人工验证来实现），本文提出了一种支持RFID的设备零件就绪管理系统（REPR-MS），以利用RFID技术进行实时监视和跟踪。设备零件准备流程。为了验证设计，开发了四个假设检验，以比较在四个不同的零件流影响区域上引入RKPR-MS之前和之后。假设是使用源自半导体封装厂的调查数据进行检验的。本文基于在REPR-MS下提出的设备零件就绪管理操作，对组合的试运行数据进行了研究。此外，本文研究了引入REPR-MS后在所研究工厂中流水线各个工位节省的生产时间以及设备零件就绪管理每个操作步骤平均时间的影响率。结果表明，采用REPR-MS后，在性能改进和成本节省方面具有巨大的潜力和前景可观的效率。

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  • 作者

    Wei-Ling Wang; Chiao-Tzu Huang; Shu-Jen Wang; Chia-Pao Chang; Hui-Wen Liao;

  • 作者单位

    Department of Industrial Engineering and Management, National Chin-Yi University of Technology, No. 57, Sec. 2, Zhongshan Rd., Taiping Dist., Taichung City, Taiwan;

    Department of Industrial Engineering and Management, National Chin-Yi University of Technology, No. 57, Sec. 2, Zhongshan Rd., Taiping Dist., Taichung City, Taiwan;

    Department of Industrial Engineering and Management, National Chin-Yi University of Technology, No. 57, Sec. 2, Zhongshan Rd., Taiping Dist., Taichung City, Taiwan;

    Department of Industrial Engineering and Management, National Chin-Yi University of Technology, No. 57, Sec. 2, Zhongshan Rd., Taiping Dist., Taichung City, Taiwan;

    Department of Information Technology, Ling-Tung University, No. 1, Ling Tung Rd., Taichung, Taiwan;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    radio frequency identification; RFID; equipment parts readiness management; semiconductor packaging plant;

    机译：射频识别;RFID;设备零件准备管理;半导体封装厂;

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