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A NOVEL METHOD FOR LOCATING SOLDER JOINTS BASED ON MODIFIED BINARY POTENTIAL FUNCTION

机译:基于修正二元势函数的新型焊点定位方法

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摘要

The solder joint location on inductors is an extremely important aspect of the industrial process; in particular, the visual location plays a fundamental role. The visual-location process is often carried out by human experts. The disadvantages associated with manual location are the large amount of time required and reduced efficiency as operator fatigue occurs. In addition, as electronic products now tend to be miniaturized, portable and with dense component layout, manual location is becoming unreliable. This has prompted the development of automatic visual-location systems to speed up the location process, increase production efficiency and improve manufacture yield rate. In this paper, we propose an automatic visual-location method for solder joints to address the problem of feature extraction in digital images, using the concept of potential functions (PF). In order to make the location method more suitable for the inductor industry, the virtual external electric field concept is introduced. The proposed location system, which uses modified binary potential functions (MBPF), has been implemented and tested with three kinds of inductors. The experimental results show that the proposed scheme performs with a high degree of accuracy, even with testing samples that are significantly different in appearance.
机译:电感器上的焊点位置是工业过程中极为重要的方面。特别是视觉位置起着至关重要的作用。视觉定位过程通常由人类专家执行。与手动定位相关的缺点是需要大量时间,并且由于操作员疲劳而降低效率。另外,由于电子产品现在趋向于小型化,便携式且具有密集的元件布局,因此手动放置变得不可靠。这促使自动视觉定位系统的发展,以加快定位过程,提高生产效率并提高制造良率。在本文中,我们提出了一种自动视觉定位焊点的方法,以解决使用电位函数(PF)概念的数字图像中的特征提取问题。为了使定位方法更适合电感器行业,引入了虚拟外部电场概念。拟议的定位系统使用修改后的二进制电势函数(MBPF),已通过三种电感器进行了实现和测试。实验结果表明,即使对外观明显不同的样品进行测试,所提方案仍具有很高的准确性。

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