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首页> 外文期刊>International Journal of Microcircuits & Electronic Packaging >Transient Thermal Analysis as a Highly Sensitive Test Method for the Reliability Investigation of High Power LEDs During Temperature Cycle Tests
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Transient Thermal Analysis as a Highly Sensitive Test Method for the Reliability Investigation of High Power LEDs During Temperature Cycle Tests

机译：瞬态热分析作为高灵敏度测试方法，用于温度循环测试期间大功率LED的可靠性研究

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摘要

Light emitting diodes (LEDs) are today standard and mature light sources. They have several key advantages such as small size, low energy consumption, and long lifetime. However, high reliability of the LED system is required to achieve long lifetime of the light source. Thermomechanical stress due to temperature cycling causes failure of electronic systems. The electronic component itself or the interconnect device, for example, the printed circuit board (PCB), might fail. In many cases, the weakest link is found to be the solder interconnect between the package and the board. Cracking of the interconnect causes an open circuit and the system fails. In this paper the existing methods are compared in order to investigate LED interconnect failures during temperature cycle tests such as the simple light-on test, electric resistance measurement, and the shear test. This paper describes and introduces transient thermal analysis as a measurement method. This paper presents the first reliability data analysis with transient thermal analysis of ceramic high power LED packages on printed circuit boards, that is, insulated metal substrates, during the air-to-air thermal shock test (-40 ℃ to +125℃) and correlates it with cross sections. This work demonstrates the sensitivity of the thermal analysis to detect solder joint failures of the assembly. This paper compares the results with electric resistance measurements and light-on tests and shows that the resolution is significantly higher compared with the methods applied today. The sensitivity of the method enables the detection of a crack in a solder joint much earlier than the final failure of the joint, that is, the open circuit.
机译：发光二极管（LED）是当今的标准和成熟的光源。它们具有几个关键优势，例如体积小，能耗低和使用寿命长。然而，需要LED系统的高可靠性来实现光源的长寿命。由于温度循环而产生的热机械应力会导致电子系统故障。电子组件本身或互连设备（例如印刷电路板（PCB））可能会发生故障。在许多情况下，发现最薄弱的环节是封装和电路板之间的焊料互连。互连的破裂会导致断路，并且系统会发生故障。在本文中，对现有方法进行了比较，以研究温度循环测试（例如简单的点亮测试，电阻测量和剪切测试）中的LED互连故障。本文介绍并介绍了瞬态热分析作为一种测量方法。本文介绍了在空对空热冲击测试（-40℃至+125℃）和温度范围内对印刷电路板上的陶瓷大功率LED封装（即绝缘金属基板）进行瞬态热分析的首次可靠性数据分析。将其与横截面关联。这项工作证明了热分析对检测组件的焊点故障的敏感性。本文将结果与电阻测量和点亮测试进行了比较，结果表明，与当今使用的方法相比，分辨率明显更高。该方法的灵敏度使得能够比焊点的最终故障（即开路）更早地检测到焊点中的裂纹。

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