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Effects of vibration on passive intermodulation of microwave connector

机译：振动对微波连接器无源互调的影响

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摘要

This paper investigates the generation of passive intermodulation (PIM) in coaxial connectors during vibration. A series of experiments were designed and the simulation model and method were proposed for understanding these phenomena. We found that PIM is mainly influenced by the contact stress and contact surface roughness during vibration. Thus, a power spectral density method is presented to identify the roughness parameter of contact surface based on the Weierstrass-Mandelbrot model, and the simulation model and method were verified by the relative experiments. Eventually, some suggestions for engineering application were provided.
机译：本文研究了振动期间同轴连接器中无源互调（PIM）的产生。设计了一系列实验，并提出了用于理解这些现象的仿真模型和方法。我们发现，PIM主要受振动过程中的接触应力和接触表面粗糙度的影响。因此，提出了一种基于Weierstrass-Mandelbrot模型的功率谱密度法来识别接触面的粗糙度参数，并通过相关实验对仿真模型和方法进行了验证。最终，为工程应用提供了一些建议。

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