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首页> 外文期刊>International journal of non-linear mechanics >The influence of temperature variations on adhesively bonded structures: A non-linear theoretical perspective
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The influence of temperature variations on adhesively bonded structures: A non-linear theoretical perspective

机译：温度变化对粘粘合结构的影响：非线性理论透视

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摘要

Nowadays, adhesively bonded structures have received exhaustive attention mainly because, contrary to mechanical joints, they are able to avoid stress concentration. When a material is externally bonded to another structural member to improve the strength or stiffness of the latter, the adhesive joint is supposed to perform well for a long time, independently of the type of loading the bonded joint will be subjected to. However, studies dedicated to this topic are scarce when it comes to the influence of thermal action. The influence of temperature variations on bonded joints is not yet well understood, so more studies are needed to improve the current level of knowledge. The present study aims to develop an analytical solution capable of simulating the interfacial bond behaviour between two structural materials subjected to thermal loading. The complete debonding processes of such adhesively bonded joints are estimated based on a bi-linear bond-slip relationship. The proposed analytical model is validated by the numerical simulation of several examples, where some parameters previously identified as potentially affecting the bond behaviour are investigated. A commercial software based on the Finite Element Method (FEM) is used to support those examples in which either the analytical or the numerical simulations agreed very well.
机译：如今，粘粘合的结构主要是主要的注意力，主要是因为与机械接头相反，它们能够避免应力集中。当物料外部粘合到另一个结构构件以改善后者的强度或刚度时，粘合接头应该在很长一段时间内执行良好，独立于加载的类型将受到粘合的接头进行。然而，致力于热动动作的影响时，致力于本主题的研究是稀缺的。温度变化对粘合接头的影响尚不清楚，因此需要更多的研究来改善当前的知识水平。本研究旨在开发能够模拟经受热负荷的两个结构材料之间的界面粘合行为的分析解决方案。基于双线性粘合性关系估计这种粘合接头的完整剥离过程。通过若干例子的数值模拟验证了所提出的分析模型，其中研究了先前识别出可能影响债券行为的一些参数。基于有限元方法（FEM）的商业软件用于支持这些实施例，其中分析或数值模拟非常吻合。

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