Optimisation of the process control in a semiconductor company: model and case study of defectivity sampling

M. Shanoun; S. Bassetto; S. Bastoini; P. Vialletelle

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Optimisation of the process control in a semiconductor company: model and case study of defectivity sampling

机译：一家半导体公司的过程控制优化：缺陷抽样的模型和案例研究

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This article studies the skip, under some assumptions, of process control operations. The case of one tool, one enhanced buffer and one metrology tool of a monotonic parameter is analysed. This article presents circumstances in which control plan can be optimised due to the buffer's behaviour. After discussing the industrial issue of defectivity, this article presents a literature review followed by the model and steps towards industrial development. Then demonstrator, which is applied at a case study of defectivity sampling, is presented. A test of over a 300-mm wafer fabrication data set shows serious improvements - around 35% of defectivity controls have been skipped compared to the static sampling plan.

机译：本文研究在某些假设下过程控制操作的跳过。分析了单调参数的一种工具，一种增强的缓冲区和一种计量工具的情况。本文介绍了由于缓冲区的行为而可以优化控制计划的情况。在讨论了缺陷性的工业问题之后，本文提出了一篇文献综述，随后介绍了工业发展的模型和步骤。然后介绍了用于缺陷率抽样案例研究的演示器。对300毫米以上的晶圆制造数据集进行的测试显示出了重大改进-与静态采样计划相比，大约35％的缺陷率控件已被跳过。

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来源
《International Journal of Production Research》 |2011年第13期|p.3873-3890|共18页
作者
M. Shanoun; S. Bassetto; S. Bastoini; P. Vialletelle;
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作者单位

Grenoble Institute of Technology, Lab. G-SCOP, CNRS, 46, Avenue Felix Viallet 38000, Grenoble, France;

Grenoble Institute of Technology, Lab. G-SCOP, CNRS, 46, Avenue Felix Viallet 38000, Grenoble, France;

STMicroelectronics, Crolles 300, France;

STMicroelectronics, Crolles 300, France;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类
关键词
process control; dynamic control plan; risk measurement; defectivity measurement;

机译：过程控制;动态控制计划;风险衡量;缺陷度测量;

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Optimisation of the process control in a semiconductor company: model and case study of defectivity sampling

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